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MT3070AE

Description
DTMF Signaling Circuit, CMOS, PDIP8, PLASTIC, DIP-8
CategoryWireless rf/communication    Telecom circuit   
File Size446KB,8 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Download Datasheet Parametric Compare View All

MT3070AE Overview

DTMF Signaling Circuit, CMOS, PDIP8, PLASTIC, DIP-8

MT3070AE Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP8,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T8
JESD-609 codee0
length9.59 mm
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum seat height5.33 mm
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Telecom integrated circuit typesDTMF SIGNALING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
Base Number Matches1
Obsolescence Notice
This product is obsolete.
This information is available for your
convenience only.
For more information on
Zarlink’s obsolete products and
replacement product lists, please visit
http://products.zarlink.com/obsolete_products/

MT3070AE Related Products

MT3070AE BURNDY_YA34A8NT119 MT3071AC MT3071AE
Description DTMF Signaling Circuit, CMOS, PDIP8, PLASTIC, DIP-8 Al Tube Uninsulated Compression Terminal, Narrow Tongue, 1 Hole, 500 kcmil Cu/Al, 3/8" Stud, 1.19" Tongue Width DTMF Signaling Circuit, CMOS, CDIP8, CERDIP-8 DTMF Signaling Circuit, CMOS, PDIP8, PLASTIC, DIP-8
Is it Rohs certified? incompatible - incompatible incompatible
package instruction DIP, DIP8,.3 - DIP, DIP8,.3 DIP, DIP8,.3
Reach Compliance Code unknown - unknown unknown
JESD-30 code R-PDIP-T8 - R-GDIP-T8 R-PDIP-T8
JESD-609 code e0 - e0 e0
Number of functions 1 - 1 1
Number of terminals 8 - 8 8
Maximum operating temperature 85 °C - 85 °C 85 °C
Minimum operating temperature -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY - CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code DIP - DIP DIP
Encapsulate equivalent code DIP8,.3 - DIP8,.3 DIP8,.3
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form IN-LINE - IN-LINE IN-LINE
power supply 5 V - 5 V 5 V
Certification status Not Qualified - Not Qualified Not Qualified
Nominal supply voltage 5 V - 5 V 5 V
surface mount NO - NO NO
technology CMOS - CMOS CMOS
Telecom integrated circuit types DTMF SIGNALING CIRCUIT - DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT
Temperature level INDUSTRIAL - INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm - 2.54 mm 2.54 mm
Terminal location DUAL - DUAL DUAL
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