MT3071AC datasheet, PDF - EEWORLD Datasheet

MT3071AC: DescriptionDTMF Signaling Circuit, CMOS, CDIP8, CERDIP-8; CategoryWireless rf/communication Telecom circuit; File Size446KB，8 Pages; ManufacturerZarlink Semiconductor (Microsemi); Websitehttp://www.zarlink.com/

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MT3071AC Overview

DTMF Signaling Circuit, CMOS, CDIP8, CERDIP-8

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Zarlink Semiconductor (Microsemi)
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
JESD-30 code	R-GDIP-T8
JESD-609 code	e0
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	DTMF SIGNALING CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

Obsolescence Notice

This product is obsolete.

This information is available for your

convenience only.

For more information on

Zarlink’s obsolete products and

replacement product lists, please visit

http://products.zarlink.com/obsolete_products/

	MT3071AC	MT3070AE	BURNDY_YA34A8NT119	MT3071AE
Description	DTMF Signaling Circuit, CMOS, CDIP8, CERDIP-8	DTMF Signaling Circuit, CMOS, PDIP8, PLASTIC, DIP-8	Al Tube Uninsulated Compression Terminal, Narrow Tongue, 1 Hole, 500 kcmil Cu/Al, 3/8" Stud, 1.19" Tongue Width	DTMF Signaling Circuit, CMOS, PDIP8, PLASTIC, DIP-8
Is it Rohs certified?	incompatible	incompatible	-	incompatible
package instruction	DIP, DIP8,.3	DIP, DIP8,.3	-	DIP, DIP8,.3
Reach Compliance Code	unknown	unknown	-	unknown
JESD-30 code	R-GDIP-T8	R-PDIP-T8	-	R-PDIP-T8
JESD-609 code	e0	e0	-	e0
Number of functions	1	1	-	1
Number of terminals	8	8	-	8
Maximum operating temperature	85 °C	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	DIP	DIP	-	DIP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	-	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	IN-LINE	-	IN-LINE
power supply	5 V	5 V	-	5 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified
Nominal supply voltage	5 V	5 V	-	5 V
surface mount	NO	NO	-	NO
technology	CMOS	CMOS	-	CMOS
Telecom integrated circuit types	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	-	DTMF SIGNALING CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	-	2.54 mm
Terminal location	DUAL	DUAL	-	DUAL

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

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