Basic information of LM10MW8 amplifier:
LM10MW8 is an OPERATIONAL AMPLIFIER. The commonly used packaging method is WAFER
LM10MW8 amplifier core information:
The minimum operating temperature of the LM10MW8 is -55 °C and the maximum operating temperature is 125 °C. Its maximum average bias current is 0.03 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the LM10MW8 has a nominal slew rate of 0.2 V/us.
The nominal supply voltage of the LM10MW8 is 20 V, and its corresponding nominal negative supply voltage is -20 V. The input offset voltage of the LM10MW8 is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of LM10MW8:
Its terminal position type is: UPPER.
LM10MW8 amplifier additional information:
Its temperature grade is: MILITARY. The corresponding JESD-30 code is: X-XUUC-N. The package code of LM10MW8 is: DIE. The materials used in the LM10MW8 package are mostly UNSPECIFIED. And its package shape is UNSPECIFIED.
The LM10MW8 package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
Basic information of LM10MW8 amplifier:
LM10MW8 is an OPERATIONAL AMPLIFIER. The commonly used packaging method is WAFER
LM10MW8 amplifier core information:
The minimum operating temperature of the LM10MW8 is -55 °C and the maximum operating temperature is 125 °C. Its maximum average bias current is 0.03 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the LM10MW8 has a nominal slew rate of 0.2 V/us.
The nominal supply voltage of the LM10MW8 is 20 V, and its corresponding nominal negative supply voltage is -20 V. The input offset voltage of the LM10MW8 is 3000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of LM10MW8:
Its terminal position type is: UPPER.
LM10MW8 amplifier additional information:
Its temperature grade is: MILITARY. The corresponding JESD-30 code is: X-XUUC-N. The package code of LM10MW8 is: DIE. The materials used in the LM10MW8 package are mostly UNSPECIFIED. And its package shape is UNSPECIFIED.
The LM10MW8 package pin format is: UNCASED CHIP. Its terminal forms are: NO LEAD.
| Parameter Name | Attribute value |
| Parts packaging code | WAFER |
| package instruction | WAFER |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Maximum average bias current (IIB) | 0.03 µA |
| Nominal Common Mode Rejection Ratio | 102 dB |
| Maximum input offset voltage | 3000 µV |
| JESD-30 code | X-XUUC-N |
| Negative supply voltage upper limit | -22.5 V |
| Nominal Negative Supply Voltage (Vsup) | -20 V |
| Number of functions | 1 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Nominal slew rate | 0.2 V/us |
| Supply voltage upper limit | 22.5 V |
| Nominal supply voltage (Vsup) | 20 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Base Number Matches | 1 |
| LM10MW8 | LM10CLWM | LM10CLMWC | LM10CLMDC | LM10CLH | LM10CLH/NOPB | |
|---|---|---|---|---|---|---|
| Description | OP-AMP, 3000uV OFFSET-MAX, UUC, WAFER | DUAL OP-AMP, 4000uV OFFSET-MAX, PDSO14, 0.300 INCH, PLASTIC, SOP-14 | OP-AMP, 5000uV OFFSET-MAX, UUC8, WAFER | OP-AMP, 5000uV OFFSET-MAX, UUC, DIE | OP-AMP, 5000uV OFFSET-MAX, MBCY8, METAL CAN-8 | OP-AMP, 5000uV OFFSET-MAX, MBCY8, METAL CAN-8 |
| package instruction | WAFER | SOP, SOP8,.5 | WAFER | DIE | , | , CAN8,.2 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Parts packaging code | WAFER | SOIC | WAFER | DIE | - | BCY |
| Maximum average bias current (IIB) | 0.03 µA | 0.03 µA | 0.04 µA | 0.04 µA | - | 0.04 µA |
| Nominal Common Mode Rejection Ratio | 102 dB | 102 dB | 102 dB | 102 dB | - | 102 dB |
| Maximum input offset voltage | 3000 µV | 4000 µV | 5000 µV | 5000 µV | - | 5000 µV |
| JESD-30 code | X-XUUC-N | R-PDSO-G14 | R-XUUC-N8 | X-XUUC-N | - | O-MBCY-W8 |
| Negative supply voltage upper limit | -22.5 V | - | -3.5 V | -3.5 V | - | -3.5 V |
| Nominal Negative Supply Voltage (Vsup) | -20 V | -3.25 V | -3.25 V | -3.25 V | - | -3.25 V |
| Number of functions | 1 | 2 | 1 | 1 | - | 1 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | - | 70 °C |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | - | METAL |
| encapsulated code | DIE | SOP | DIE | DIE | - | - |
| Package shape | UNSPECIFIED | RECTANGULAR | RECTANGULAR | UNSPECIFIED | - | ROUND |
| Package form | UNCASED CHIP | SMALL OUTLINE | UNCASED CHIP | UNCASED CHIP | - | CYLINDRICAL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Nominal slew rate | 0.2 V/us | - | 0.2 V/us | 0.2 V/us | - | 0.2 V/us |
| Supply voltage upper limit | 22.5 V | 7 V | 3.5 V | 3.5 V | - | 3.5 V |
| Nominal supply voltage (Vsup) | 20 V | 3.25 V | 3.25 V | 3.25 V | - | 3.25 V |
| surface mount | YES | YES | YES | YES | - | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - | BIPOLAR |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| Terminal form | NO LEAD | GULL WING | NO LEAD | NO LEAD | - | WIRE |
| Terminal location | UPPER | DUAL | UPPER | UPPER | - | BOTTOM |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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