BBL-131-G-A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> The connector> BBL-131-G-A

BBL-131-G-A: DescriptionBoard Connector; CategoryThe connector The connector; File Size412KB，1 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/

Download Datasheet Parametric View All

BBL-131-G-A Overview

Board Connector

BBL-131-G-A Parametric

Parameter Name	Attribute value
Reach Compliance Code	compliant
ECCN code	EAR99
Connector type	BOARD CONNECTOR
Manufacturer's serial number	BBL
Base Number Matches	1

Preview

Download Datasheet

View All

BBS–116–G–C

F-214

BDL–120–T–F

BBL

(3.89 mm)

.153"

BBS–108–T–A

(2,54 mm) .100"

BBS–120–T–B

BBS, BBL, BHS, BBD, BDL SERIES

MACHINED BOARD STACKING STRIPS

Mates with:

SS, SD, HSS, SL, SDL,

ESS, ESD

TYPE

STRIP

NO. PINS

PER ROW

PLATING

OPTION

LEAD

STYLE

FEATURES

•

Low proﬁle design

achieves (3,89 mm)

.153" board spacings

when mated with SL

Series.

•

Approach the reliability

of a permanent

connection with the

ﬂexibility of a separable

connection.

BBS

= Standard Single Row

(2,54) .100 x No. of Positions

(2,54)

.100

(2,54) .100 TYP

(1,27)

.050

–G

=20 µ" (0,51 µm)

Gold

BBL

= Low Proﬁle Single Row

(2,54)

.100

–T

=Tin

BBL body available with

Styles –E & –F only.

BHS

= High Temp Single Row

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?BBS,

www.samtec.com?BBL,

www.samtec.com?BHS

www.samtec.com?BBD or

www.samtec.com?BDL

Insulator Material:

Black Glass Filled Polyester

(BBS, BBD, BBL)

Black High Temp Nylon

(BDL)

Black Liquid Crystal Polymer

(BHS)

Temperature Range:

-55°C to +125°C

Terminal Material:

Phosphor Bronze or Brass

Plating:

Au or Sn over 50µ" (1,27 µm) Ni

RoHS Compliant:

Yes

Lead-Free Solderable:

Wave only

(BBS, BBD, BBL, BDL))

Wave, or reﬂow with

all Au (BHS)

BBS

BHS

BBL

(2,54) .100 x No. of Positions

BBD

= Standard Double Row

(5,08)

.200

(2,54) .100 TYP

(2,54)

.100

(1,27)

.050

01 thru 32

= BBS & BBL

BDL

= Low Proﬁle Double Row

(2,54)

.100

01 thru 36

BDL body available with

Styles –E & –F only.

= BBD, BDL & BHS

BBD

BDL

–A

Z = (5,33 mm) .210"

–B

Z = (8,51 mm) .335"

–C

Z = (14,86 mm) .585"

–E

Z = (1,78 mm) .070"

–F

Z = (2,16 mm) .085"

RECOGNITIONS

For complete scope

of recognitions see

www.samtec.com/quality

(3,18)

.125

(0,46)

.018

DIA

(1,27)

.050

Style E:

(2,74)

.108

Style F:

(3,18)

.125

(0,46)

.018 DIA

(1,78)

.070 DIA

(0,46)

.018 DIA

(3,18)

.125

(1,78)

.070

DIA

(1,27)

.050 DIA

(0,46)

.018

DIA

BBL

Series

(3,18)

.125

BBD

Series

BDL

Series

BBS and BHS

Series

Note:

Some lengths, styles

and options are non-standard,

non-returnable.

WWW.SAMTEC.COM

Recommended Resources

Touchpad interface circuit (IBM ThinkPad T60)

Transistor reference basic bias circuit - fixed bias

Energy-saving three-phase asynchronous motor phase failure protection circuit

Voltage controlled oscillation signal generator circuit

120V/25mA DC voltage converter

A novice asks for advice on the MSP430 interrupt flag PxIFG: [i=s]This post was last edited by baqs603 on 2021-8-5 10:32[/i]Recently, when I was learning about the debouncing of mechanical buttons of MSP430, there was a sentence in the book that I didn't quite ...; baqs603 TI Technology Forum

Ask about VirtualWiFi virtual network programming: I wonder if there are any friends who are studying VirutalWiFi. I have a question about the buffer part and would like to ask you. // Send Buffer Data Structures, one for each SSID QUEUE_HEADER SendWa...; fengyiqishi Embedded System

Haijia Network actively promotes the industrialization of the Internet of Things and was invited to participate in the Shanghai Internet of Things Center Industry-University-Research Cooperation Symposium: Source: Author: higughard Release time: 2010-05-18 On April 22, 2010, Haijia Network was invited as a corporate representative to attend the Shanghai Internet of Things Center Industry-University-Rese...; bg4xda Embedded System

Brief Introduction of Process Performance of Cross-linked Cable: 1. Concept Cross-linked cable usually refers to the insulation layer of the cable using cross-linked materials. The most commonly used material is cross-linked polyethylene (XLPE). The cross-linking p...; taojl2006 Industrial Control Electronics

Does anyone have any other accessories for ARM9?: Please help - -Newbies have not yet come into contact with ARM.I have a Samsung S3C2410 ARM9 board. It's just a development board. It doesn't have anything like a power supply or a data cable. I want ...; 谢谢分享 Buy&Sell

Reprint of electromagnetic compatibility terms: [align=left]This standard is equivalent to Chapter 161 (1990 edition) of the International Electrotechnical Commission (IEC) International Electrotechnical Vocabulary (IEV). This standard specifies th...; blink Power technology

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components