OTP ROM, 512X8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| Other features | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| length | 31.877 mm |
| memory density | 4096 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512X8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programming voltage | 12.5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.12 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| CY7C225A-40DMB | CY7C225A-25DMB | CY7C225A-30DC | CY7C225A-25LMB | CY7C225A-40JC | CY7C225A-18JC | CY7C225A-25DC | CY7C225A-30LMB | |
|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 512X8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | OTP ROM, 512X8, 15ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | OTP ROM, 512X8, 12ns, CMOS, CQCC28, LCC-28 | OTP ROM, 512X8, 25ns, CMOS, PQCC28, PLASTIC, LCC-28 | OTP ROM, 512X8, 12ns, CMOS, PQCC28, PLASTIC, LCC-28 | OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | OTP ROM, 512X8, 15ns, CMOS, CQCC28, LCC-28 |
| Parts packaging code | DIP | DIP | DIP | QLCC | QLCC | QLCC | DIP | QLCC |
| package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | PLASTIC, LCC-28 | PLASTIC, LCC-28 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ |
| Contacts | 24 | 24 | 24 | 28 | 28 | 28 | 24 | 28 |
| Reach Compliance Code | not_compliant | compliant | unknown | compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 25 ns | 12 ns | 15 ns | 12 ns | 25 ns | 12 ns | 12 ns | 15 ns |
| Other features | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS | BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | S-PQCC-J28 | S-PQCC-J28 | R-GDIP-T24 | S-CQCC-N28 |
| length | 31.877 mm | 31.877 mm | 31.877 mm | 11.43 mm | 11.5316 mm | 11.5316 mm | 31.877 mm | 11.43 mm |
| memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 28 | 28 | 28 | 24 | 28 |
| word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| organize | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | QCCN | QCCJ | QCCJ | DIP | QCCN |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LDCC28,.5SQ | LDCC28,.5SQ | DIP24,.3 | LCC28,.45SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming voltage | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 1.9812 mm | 4.572 mm | 4.572 mm | 5.08 mm | 1.9812 mm |
| Maximum standby current | 0.12 A | 0.12 A | 0.09 A | 0.12 A | 0.09 A | 0.09 A | 0.09 A | 0.12 A |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.09 mA | 0.12 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | YES | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | J BEND | J BEND | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 11.43 mm | 11.5316 mm | 11.5316 mm | 7.62 mm | 11.43 mm |
| Is it Rohs certified? | incompatible | - | - | - | incompatible | incompatible | incompatible | incompatible |
| JESD-609 code | e0 | - | - | - | e0 | e0 | e0 | e0 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | - | NOT SPECIFIED | 225 | NOT SPECIFIED | 240 |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | - | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 |
| Maker | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
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