CY7C225A-18JC datasheet, PDF - EEWORLD Datasheet

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CY7C225A-18JC: DescriptionOTP ROM, 512X8, 12ns, CMOS, PQCC28, PLASTIC, LCC-28; Categorystorage storage; File Size249KB，7 Pages; ManufacturerCypress Semiconductor

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CY7C225A-18JC Overview

OTP ROM, 512X8, 12ns, CMOS, PQCC28, PLASTIC, LCC-28

CY7C225A-18JC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	QLCC
package instruction	PLASTIC, LCC-28
Contacts	28
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	12 ns
Other features	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS
I/O type	COMMON
JESD-30 code	S-PQCC-J28
JESD-609 code	e0
length	11.5316 mm
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC28,.5SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Programming voltage	12.5 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum standby current	0.09 A
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	11.5316 mm

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CY7C225A-18JC Related Products

	CY7C225A-18JC	CY7C225A-25DMB	CY7C225A-30DC	CY7C225A-40DMB	CY7C225A-25LMB	CY7C225A-40JC	CY7C225A-25DC	CY7C225A-30LMB
Description	OTP ROM, 512X8, 12ns, CMOS, PQCC28, PLASTIC, LCC-28	OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24	OTP ROM, 512X8, 15ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24	OTP ROM, 512X8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24	OTP ROM, 512X8, 12ns, CMOS, CQCC28, LCC-28	OTP ROM, 512X8, 25ns, CMOS, PQCC28, PLASTIC, LCC-28	OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24	OTP ROM, 512X8, 15ns, CMOS, CQCC28, LCC-28
Parts packaging code	QLCC	DIP	DIP	DIP	QLCC	QLCC	DIP	QLCC
package instruction	PLASTIC, LCC-28	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC28,.45SQ	PLASTIC, LCC-28	DIP, DIP24,.3	QCCN, LCC28,.45SQ
Contacts	28	24	24	24	28	28	24	28
Reach Compliance Code	not_compliant	compliant	unknown	not_compliant	compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	12 ns	12 ns	15 ns	25 ns	12 ns	25 ns	12 ns	15 ns
Other features	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQCC-J28	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	S-CQCC-N28	S-PQCC-J28	R-GDIP-T24	S-CQCC-N28
length	11.5316 mm	31.877 mm	31.877 mm	31.877 mm	11.43 mm	11.5316 mm	31.877 mm	11.43 mm
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	24	24	24	28	28	24	28
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	70 °C	125 °C	125 °C	70 °C	70 °C	125 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCJ	DIP	DIP	DIP	QCCN	QCCJ	DIP	QCCN
Encapsulate equivalent code	LDCC28,.5SQ	DIP24,.3	DIP24,.3	DIP24,.3	LCC28,.45SQ	LDCC28,.5SQ	DIP24,.3	LCC28,.45SQ
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	5.08 mm	5.08 mm	5.08 mm	1.9812 mm	4.572 mm	5.08 mm	1.9812 mm
Maximum standby current	0.09 A	0.12 A	0.09 A	0.12 A	0.12 A	0.09 A	0.09 A	0.12 A
Maximum slew rate	0.09 mA	0.12 mA	0.09 mA	0.12 mA	0.12 mA	0.09 mA	0.09 mA	0.12 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	J BEND	THROUGH-HOLE	NO LEAD
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	QUAD
width	11.5316 mm	7.62 mm	7.62 mm	7.62 mm	11.43 mm	11.5316 mm	7.62 mm	11.43 mm
Is it Rohs certified?	incompatible	-	-	incompatible	-	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
JESD-609 code	e0	-	-	e0	-	e0	e0	e0
Peak Reflow Temperature (Celsius)	225	-	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	240
Terminal surface	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	30	-	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	30

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