CY7C225A-25DC datasheet, PDF - EEWORLD Datasheet

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CY7C225A-25DC: DescriptionOTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24; Categorystorage storage; File Size249KB，7 Pages; ManufacturerCypress Semiconductor

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CY7C225A-25DC Overview

OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24

CY7C225A-25DC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	12 ns
Other features	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS
I/O type	COMMON
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.877 mm
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12.5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.09 A
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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CY7C225A-25DC Related Products

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Description	OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24	OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24	OTP ROM, 512X8, 15ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24	OTP ROM, 512X8, 25ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24	OTP ROM, 512X8, 12ns, CMOS, CQCC28, LCC-28	OTP ROM, 512X8, 25ns, CMOS, PQCC28, PLASTIC, LCC-28	OTP ROM, 512X8, 12ns, CMOS, PQCC28, PLASTIC, LCC-28	OTP ROM, 512X8, 15ns, CMOS, CQCC28, LCC-28
Parts packaging code	DIP	DIP	DIP	DIP	QLCC	QLCC	QLCC	QLCC
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC28,.45SQ	PLASTIC, LCC-28	PLASTIC, LCC-28	QCCN, LCC28,.45SQ
Contacts	24	24	24	24	28	28	28	28
Reach Compliance Code	not_compliant	compliant	unknown	not_compliant	compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	12 ns	12 ns	15 ns	25 ns	12 ns	25 ns	12 ns	15 ns
Other features	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	S-CQCC-N28	S-PQCC-J28	S-PQCC-J28	S-CQCC-N28
length	31.877 mm	31.877 mm	31.877 mm	31.877 mm	11.43 mm	11.5316 mm	11.5316 mm	11.43 mm
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	28	28	28	28
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	70 °C	125 °C	125 °C	70 °C	70 °C	125 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	QCCN	QCCJ	QCCJ	QCCN
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	LCC28,.45SQ	LDCC28,.5SQ	LDCC28,.5SQ	LCC28,.45SQ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V	12.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	1.9812 mm	4.572 mm	4.572 mm	1.9812 mm
Maximum standby current	0.09 A	0.12 A	0.09 A	0.12 A	0.12 A	0.09 A	0.09 A	0.12 A
Maximum slew rate	0.09 mA	0.12 mA	0.09 mA	0.12 mA	0.12 mA	0.09 mA	0.09 mA	0.12 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	J BEND	J BEND	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	QUAD
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	11.43 mm	11.5316 mm	11.5316 mm	11.43 mm
Is it Rohs certified?	incompatible	-	-	incompatible	-	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
JESD-609 code	e0	-	-	e0	-	e0	e0	e0
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	-	NOT SPECIFIED	-	NOT SPECIFIED	225	240
Terminal surface	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	-	NOT SPECIFIED	-	NOT SPECIFIED	30	30

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