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WEDPN4M64V-125BI

Description
Synchronous DRAM, 4MX64, 6ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219
Categorystorage    storage   
File Size385KB,12 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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WEDPN4M64V-125BI Overview

Synchronous DRAM, 4MX64, 6ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219

WEDPN4M64V-125BI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instruction21 X 21 MM, PLASTIC, BGA-219
Reach Compliance Codeunknown
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Spare memory width32
Maximum clock frequency (fCLK)125 MHz
I/O typeCOMMON
JESD-30 codeS-PBGA-B219
length21 mm
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width64
Number of functions1
Number of ports1
Number of terminals219
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX64
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA219,16X16,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height2.2 mm
self refreshYES
Maximum standby current0.18 A
Maximum slew rate0.56 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width21 mm
Base Number Matches1
White Electronic Designs
4Mx64 Synchronous DRAM
FEATURES
High Frequency = 100, 125, 133MHz
Package:
• 219 Plastic Ball Grid Array (PBGA), 21 x 21mm
Single 3.3V ±0.3V power supply
Fully Synchronous; all signals registered on positive
edge of system clock cycle
Internal pipelined operation; column address can be
changed every clock cycle
Internal banks for hiding row access/precharge
Programmable Burst length 1,2,4,8 or full page
4096 refresh cycles
Commercial, Industrial and Military Temperature
Ranges
Organized as 4M x 64
• User Configurable as 2x4Mx32 or 4x4Mx16
Weight: WEDPN4M64V-XBX - 2 grams typical
WEDPN4M64V-XBX
GENERAL DESCRIPTION
The 32MByte (256Mb) SDRAM is a high-speed CMOS,
dynamic random-access ,memory using 4 chips containing
67,108,864 bits. Each chip is internally configured as a
quad-bank DRAM with a synchronous interface. Each of the
chip’s 16,777,216-bit banks is organized as 4,096 rows by
256 columns by 16 bits.
Read and write accesses to the SDRAM are burst oriented;
accesses start at a selected location and continue for
a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an ACTIVE
command, which is then followed by a READ or WRITE
command. The address bits registered coincident with the
ACTIVE command are used to select the bank and row to
be accessed (BA0, BA1 select the bank; A0-11 select the
row). The address bits registered coincident with the READ
or WRITE command are used to select the starting column
location for the burst access.
The SDRAM provides for programmable READ or WRITE
burst lengths of 1, 2, 4 or 8 locations, or the full page, with
a burst terminate option. An AUTO PRECHARGE function
may be enabled to provide a self-timed row precharge that
is initiated at the end of the burst sequence.
The 256Mb SDRAM uses an internal pipelined architecture to
achieve high-speed operation. This architecture is compatible
with the 2n rule of prefetch architectures, but it also allows
the column address to be changed on every clock cycle to
achieve a high-speed, fully random access. Precharging one
bank while accessing one of the other three banks will hide
the precharge cycles and provide seamless, high-speed,
random-access operation.
The 256Mb SDRAM is designed to operate in 3.3V, low-
power memory systems. An auto refresh mode is provided,
along with a power-saving, power-down mode.
BENEFITS
58% SPACE SAVINGS
Reduced part count
Reduced trace lengths for lower parasitic
capacitance
Laminate interposer for optimum TCE match
Suitable for hi-reliability applications
Upgradeable to 8M x 64 (contact factory for
availability)
*This product is subject to change without notice.
11.9
Discrete Approach
ACTUAL SIZE
21
WEDPN4M64V-XBX
22.3
54
TSOP
54
TSOP
54
TSOP
54
TSOP
21
S
A
V
I
N
G
S
58%
Area
January 2005
Rev. 8
4 x 265mm
2
= 1061mm
2
441mm
2
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

WEDPN4M64V-125BI Related Products

WEDPN4M64V-125BI WEDPN4M64V-100BI WEDPN4M64V-133BI WEDPN4M64V-100BC
Description Synchronous DRAM, 4MX64, 6ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219 Synchronous DRAM, 4MX64, 7ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219 Synchronous DRAM, 4MX64, 5.5ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219 Synchronous DRAM, 4MX64, 7ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction 21 X 21 MM, PLASTIC, BGA-219 21 X 21 MM, PLASTIC, BGA-219 BGA, 21 X 21 MM, PLASTIC, BGA-219
Reach Compliance Code unknown unknown unknown unknown
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 6 ns 7 ns 5.5 ns 7 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Spare memory width 32 32 32 32
JESD-30 code S-PBGA-B219 S-PBGA-B219 S-PBGA-B219 S-PBGA-B219
memory density 268435456 bit 268435456 bit 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 64 64 64 64
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 219 219 219 219
word count 4194304 words 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 70 °C
Minimum operating temperature -40 °C -40 °C -40 °C -
organize 4MX64 4MX64 4MX64 4MX64
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES YES YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal form BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 1 1
Maximum clock frequency (fCLK) 125 MHz 100 MHz - 100 MHz
I/O type COMMON COMMON - COMMON
length 21 mm 21 mm - 21 mm
Output characteristics 3-STATE 3-STATE - 3-STATE
Encapsulate equivalent code BGA219,16X16,50 BGA219,16X16,50 - BGA219,16X16,50
power supply 3.3 V 3.3 V - 3.3 V
refresh cycle 4096 4096 - 4096
Maximum seat height 2.2 mm 2.2 mm - 2.2 mm
Maximum standby current 0.18 A 0.18 A - 0.18 A
Maximum slew rate 0.56 mA 0.56 mA - 0.56 mA
width 21 mm 21 mm - 21 mm

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