SN74LVC2G34DBVT datasheet, PDF

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SN74LVC2G34DBVT: DescriptionDual Buffer Gate 6-SOT-23 -40 to 125; Categorylogic logic; File Size1MB，25 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74LVC2G34DBVT Overview

Dual Buffer Gate 6-SOT-23 -40 to 125

SN74LVC2G34DBVT Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SOT-23
package instruction	LSSOP, TSOP6,.11,37
Contacts	6
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
Samacsys Descripti	Texas Instruments SN74LVC2G34DBVT, Dual, Buffer, Single Ended, Non-Inverting, 1.65 → 5.5 V, 6-Pin SOT-23
series	LVC/LCX/Z
JESD-30 code	R-PDSO-G6
JESD-609 code	e4
length	2.9 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.032 A
Humidity sensitivity level	1
Number of functions	2
Number of entries	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LSSOP
Encapsulate equivalent code	TSOP6,.11,37
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packing	TR
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Maximum supply current (ICC)	0.01 mA
Prop。Delay @ Nom-Su	4.1 ns
propagation delay (tpd)	8.6 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.45 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.95 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1.6 mm
Base Number Matches	1

SN74LVC2G34DBVT Related Products

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Description	Dual Buffer Gate 6-SOT-23 -40 to 125	Buffer 2-CH Non-Inverting CMOS 6-Pin SC-70 T/R	Buffer 2-CH Non-Inverting CMOS 6-Pin SC-70 T/R	Dual Buffer Gate 6-SOT-23 -40 to 125	Dual Buffer Gate 6-DSBGA -40 to 85	Dual Buffer Gate 6-SOT-5X3 -40 to 125	Buffer 2-CH Non-Inverting Push-Pull CMOS 6-Pin SOT-23 T/R	Dual Buffer Gate 6-SOT-23 -40 to 125
Brand Name	Texas Instruments	-	-	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments
Is it lead-free?	Lead free	-	-	Lead free	Lead free	Lead free	-	Lead free
Is it Rohs certified?	conform to	-	-	conform to	conform to	conform to	-	conform to
Parts packaging code	SOT-23	-	-	SOT-23	BGA	SOT	-	SOT-23
package instruction	LSSOP, TSOP6,.11,37	-	-	LSSOP, TSOP6,.11,37	DSBGA-6	VSOF, FL6,.047,20	-	LSSOP, TSOP6,.11,37
Contacts	6	-	-	6	6	6	-	6
Reach Compliance Code	compli	-	-	compli	compli	compli	-	compli
ECCN code	EAR99	-	-	EAR99	EAR99	EAR99	-	EAR99
Factory Lead Time	1 week	-	-	6 weeks	1 week	1 week	-	6 weeks
series	LVC/LCX/Z	-	-	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	-	LVC/LCX/Z
JESD-30 code	R-PDSO-G6	-	-	R-PDSO-G6	R-XBGA-B6	R-PDSO-F6	-	R-PDSO-G6
JESD-609 code	e4	-	-	e4	e1	e4	-	e4
length	2.9 mm	-	-	2.9 mm	1.4 mm	1.6 mm	-	2.9 mm
Load capacitance (CL)	50 pF	-	-	50 pF	50 pF	50 pF	-	50 pF
Logic integrated circuit type	BUFFER	-	-	BUFFER	BUFFER	BUFFER	-	BUFFER
MaximumI(ol)	0.032 A	-	-	0.032 A	0.032 A	0.032 A	-	0.032 A
Humidity sensitivity level	1	-	-	1	1	1	-	1
Number of functions	2	-	-	2	2	2	-	2
Number of entries	1	-	-	1	1	1	-	1
Number of terminals	6	-	-	6	6	6	-	6
Maximum operating temperature	125 °C	-	-	125 °C	85 °C	125 °C	-	125 °C
Minimum operating temperature	-40 °C	-	-	-40 °C	-40 °C	-40 °C	-	-40 °C
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	LSSOP	-	-	LSSOP	VFBGA	VSOF	-	LSSOP
Encapsulate equivalent code	TSOP6,.11,37	-	-	TSOP6,.11,37	BGA6,2X3,20	FL6,.047,20	-	TSOP6,.11,37
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	-	-	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packing	TR	-	-	TR	TR	TR	-	TR
Peak Reflow Temperature (Celsius)	260	-	-	260	260	260	-	260
power supply	3.3 V	-	-	3.3 V	3.3 V	3.3 V	-	3.3 V
Maximum supply current (ICC)	0.01 mA	-	-	0.01 mA	0.01 mA	0.01 mA	-	0.01 mA
Prop。Delay @ Nom-Su	4.1 ns	-	-	4.1 ns	4.1 ns	9.6 ns	-	4.1 ns
propagation delay (tpd)	8.6 ns	-	-	8.6 ns	8.6 ns	9.6 ns	-	8.6 ns
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Schmitt trigger	NO	-	-	NO	NO	NO	-	NO
Maximum seat height	1.45 mm	-	-	1.45 mm	0.5 mm	0.6 mm	-	1.45 mm
Maximum supply voltage (Vsup)	5.5 V	-	-	5.5 V	5.5 V	5.5 V	-	5.5 V
Minimum supply voltage (Vsup)	1.65 V	-	-	1.65 V	1.65 V	1.65 V	-	1.65 V
Nominal supply voltage (Vsup)	1.8 V	-	-	1.8 V	1.8 V	1.8 V	-	1.8 V
surface mount	YES	-	-	YES	YES	YES	-	YES
technology	CMOS	-	-	CMOS	CMOS	CMOS	-	CMOS
Temperature level	AUTOMOTIVE	-	-	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	-	AUTOMOTIVE
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	-	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Silver/Copper (Sn/Ag/Cu)	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	-	-	GULL WING	BALL	FLAT	-	GULL WING
Terminal pitch	0.95 mm	-	-	0.95 mm	0.5 mm	0.5 mm	-	0.95 mm
Terminal location	DUAL	-	-	DUAL	BOTTOM	DUAL	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
width	1.6 mm	-	-	1.6 mm	0.9 mm	1.2 mm	-	1.6 mm

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