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SN74LVC2G34DBVRG4

Description
Buffer 2-CH Non-Inverting Push-Pull CMOS 6-Pin SOT-23 T/R
CategoryBuffer and line drives   
File Size1MB,25 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74LVC2G34DBVRG4 Overview

Buffer 2-CH Non-Inverting Push-Pull CMOS 6-Pin SOT-23 T/R

SN74LVC2G34DBVRG4 Parametric

Parameter NameAttribute value
EU restricts the use of certain hazardous substancesCompliant
ECCN (US)EAR99
Part StatusActive
Logic FamilyLVC
Logic FunctionBuffer
Number of Elements per Chip2
Number of Channels per Chip2
Number of Inputs per Chip2
Number of Input Enables per Chip0
Number of Outputs per Chip2
Number of Output Enables per Chip0
Bus HoldNo
PolarityNon-Inverting
Maximum Propagation Delay Time @ Maximum CL (ns)4.1@3.3V|3.2@5V
Absolute Propagation Delay Time (ns)8.6
Process TechnologyCMOS
Input Signal TypeSingle-Ended
Output TypePush-Pull
Maximum Low Level Output Current (mA)32
Maximum High Level Output Current (mA)-32
Minimum Operating Supply Voltage (V)1.65
Typical Operating Supply Voltage (V)5|1.8|2.5|3.3
Maximum Operating Supply Voltage (V)5.5
Tolerant I/Os (V)5.5
Maximum Quiescent Current (uA)10
Propagation Delay Test Condition (pF)50
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)125
PackagingTape and Reel
Standard Package NameSOT
Pin Count6
Supplier PackageSOT-23
MountingSurface Mount
Package Height1.1
Package Length3.05(Max)
Package Width1.75(Max)
PCB changed6
Lead ShapeGull-wing

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Description Buffer 2-CH Non-Inverting Push-Pull CMOS 6-Pin SOT-23 T/R Buffer 2-CH Non-Inverting CMOS 6-Pin SC-70 T/R Buffer 2-CH Non-Inverting CMOS 6-Pin SC-70 T/R Dual Buffer Gate 6-SOT-23 -40 to 125 Dual Buffer Gate 6-SOT-23 -40 to 125 Dual Buffer Gate 6-DSBGA -40 to 85 Dual Buffer Gate 6-SOT-5X3 -40 to 125 Dual Buffer Gate 6-SOT-23 -40 to 125
Brand Name - - - Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? - - - Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? - - - conform to conform to conform to conform to conform to
Parts packaging code - - - SOT-23 SOT-23 BGA SOT SOT-23
package instruction - - - LSSOP, TSOP6,.11,37 LSSOP, TSOP6,.11,37 DSBGA-6 VSOF, FL6,.047,20 LSSOP, TSOP6,.11,37
Contacts - - - 6 6 6 6 6
Reach Compliance Code - - - compli compli compli compli compli
ECCN code - - - EAR99 EAR99 EAR99 EAR99 EAR99
Factory Lead Time - - - 6 weeks 1 week 1 week 1 week 6 weeks
series - - - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code - - - R-PDSO-G6 R-PDSO-G6 R-XBGA-B6 R-PDSO-F6 R-PDSO-G6
JESD-609 code - - - e4 e4 e1 e4 e4
length - - - 2.9 mm 2.9 mm 1.4 mm 1.6 mm 2.9 mm
Load capacitance (CL) - - - 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type - - - BUFFER BUFFER BUFFER BUFFER BUFFER
MaximumI(ol) - - - 0.032 A 0.032 A 0.032 A 0.032 A 0.032 A
Humidity sensitivity level - - - 1 1 1 1 1
Number of functions - - - 2 2 2 2 2
Number of entries - - - 1 1 1 1 1
Number of terminals - - - 6 6 6 6 6
Maximum operating temperature - - - 125 °C 125 °C 85 °C 125 °C 125 °C
Minimum operating temperature - - - -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material - - - PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - - LSSOP LSSOP VFBGA VSOF LSSOP
Encapsulate equivalent code - - - TSOP6,.11,37 TSOP6,.11,37 BGA6,2X3,20 FL6,.047,20 TSOP6,.11,37
Package shape - - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packing - - - TR TR TR TR TR
Peak Reflow Temperature (Celsius) - - - 260 260 260 260 260
power supply - - - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Maximum supply current (ICC) - - - 0.01 mA 0.01 mA 0.01 mA 0.01 mA 0.01 mA
Prop。Delay @ Nom-Su - - - 4.1 ns 4.1 ns 4.1 ns 9.6 ns 4.1 ns
propagation delay (tpd) - - - 8.6 ns 8.6 ns 8.6 ns 9.6 ns 8.6 ns
Certification status - - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger - - - NO NO NO NO NO
Maximum seat height - - - 1.45 mm 1.45 mm 0.5 mm 0.6 mm 1.45 mm
Maximum supply voltage (Vsup) - - - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - - - 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) - - - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount - - - YES YES YES YES YES
technology - - - CMOS CMOS CMOS CMOS CMOS
Temperature level - - - AUTOMOTIVE AUTOMOTIVE INDUSTRIAL AUTOMOTIVE AUTOMOTIVE
Terminal surface - - - Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form - - - GULL WING GULL WING BALL FLAT GULL WING
Terminal pitch - - - 0.95 mm 0.95 mm 0.5 mm 0.5 mm 0.95 mm
Terminal location - - - DUAL DUAL BOTTOM DUAL DUAL
Maximum time at peak reflow temperature - - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - - - 1.6 mm 1.6 mm 0.9 mm 1.2 mm 1.6 mm
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