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SN74LVC2G34DBVRE4

Description
Dual Buffer Gate 6-SOT-23 -40 to 125
Categorylogic    logic   
File Size1MB,25 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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SN74LVC2G34DBVRE4 Overview

Dual Buffer Gate 6-SOT-23 -40 to 125

SN74LVC2G34DBVRE4 Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOT-23
package instructionLSSOP, TSOP6,.11,37
Contacts6
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time6 weeks
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G6
JESD-609 codee4
length2.9 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.032 A
Humidity sensitivity level1
Number of functions2
Number of entries1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLSSOP
Encapsulate equivalent codeTSOP6,.11,37
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packingTR
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Maximum supply current (ICC)0.01 mA
Prop。Delay @ Nom-Su4.1 ns
propagation delay (tpd)8.6 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.45 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.95 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width1.6 mm

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Description Dual Buffer Gate 6-SOT-23 -40 to 125 Buffer 2-CH Non-Inverting CMOS 6-Pin SC-70 T/R Buffer 2-CH Non-Inverting CMOS 6-Pin SC-70 T/R Dual Buffer Gate 6-SOT-23 -40 to 125 Dual Buffer Gate 6-DSBGA -40 to 85 Dual Buffer Gate 6-SOT-5X3 -40 to 125 Buffer 2-CH Non-Inverting Push-Pull CMOS 6-Pin SOT-23 T/R Dual Buffer Gate 6-SOT-23 -40 to 125
Brand Name Texas Instruments - - Texas Instruments Texas Instruments Texas Instruments - Texas Instruments
Is it lead-free? Lead free - - Lead free Lead free Lead free - Lead free
Is it Rohs certified? conform to - - conform to conform to conform to - conform to
Parts packaging code SOT-23 - - SOT-23 BGA SOT - SOT-23
package instruction LSSOP, TSOP6,.11,37 - - LSSOP, TSOP6,.11,37 DSBGA-6 VSOF, FL6,.047,20 - LSSOP, TSOP6,.11,37
Contacts 6 - - 6 6 6 - 6
Reach Compliance Code compli - - compli compli compli - compli
ECCN code EAR99 - - EAR99 EAR99 EAR99 - EAR99
Factory Lead Time 6 weeks - - 1 week 1 week 1 week - 6 weeks
series LVC/LCX/Z - - LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z - LVC/LCX/Z
JESD-30 code R-PDSO-G6 - - R-PDSO-G6 R-XBGA-B6 R-PDSO-F6 - R-PDSO-G6
JESD-609 code e4 - - e4 e1 e4 - e4
length 2.9 mm - - 2.9 mm 1.4 mm 1.6 mm - 2.9 mm
Load capacitance (CL) 50 pF - - 50 pF 50 pF 50 pF - 50 pF
Logic integrated circuit type BUFFER - - BUFFER BUFFER BUFFER - BUFFER
MaximumI(ol) 0.032 A - - 0.032 A 0.032 A 0.032 A - 0.032 A
Humidity sensitivity level 1 - - 1 1 1 - 1
Number of functions 2 - - 2 2 2 - 2
Number of entries 1 - - 1 1 1 - 1
Number of terminals 6 - - 6 6 6 - 6
Maximum operating temperature 125 °C - - 125 °C 85 °C 125 °C - 125 °C
Minimum operating temperature -40 °C - - -40 °C -40 °C -40 °C - -40 °C
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code LSSOP - - LSSOP VFBGA VSOF - LSSOP
Encapsulate equivalent code TSOP6,.11,37 - - TSOP6,.11,37 BGA6,2X3,20 FL6,.047,20 - TSOP6,.11,37
Package shape RECTANGULAR - - RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE, SHRINK PITCH - - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
method of packing TR - - TR TR TR - TR
Peak Reflow Temperature (Celsius) 260 - - 260 260 260 - 260
power supply 3.3 V - - 3.3 V 3.3 V 3.3 V - 3.3 V
Maximum supply current (ICC) 0.01 mA - - 0.01 mA 0.01 mA 0.01 mA - 0.01 mA
Prop。Delay @ Nom-Su 4.1 ns - - 4.1 ns 4.1 ns 9.6 ns - 4.1 ns
propagation delay (tpd) 8.6 ns - - 8.6 ns 8.6 ns 9.6 ns - 8.6 ns
Certification status Not Qualified - - Not Qualified Not Qualified Not Qualified - Not Qualified
Schmitt trigger NO - - NO NO NO - NO
Maximum seat height 1.45 mm - - 1.45 mm 0.5 mm 0.6 mm - 1.45 mm
Maximum supply voltage (Vsup) 5.5 V - - 5.5 V 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 1.65 V - - 1.65 V 1.65 V 1.65 V - 1.65 V
Nominal supply voltage (Vsup) 1.8 V - - 1.8 V 1.8 V 1.8 V - 1.8 V
surface mount YES - - YES YES YES - YES
technology CMOS - - CMOS CMOS CMOS - CMOS
Temperature level AUTOMOTIVE - - AUTOMOTIVE INDUSTRIAL AUTOMOTIVE - AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) - - Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn/Ag/Cu) Nickel/Palladium/Gold (Ni/Pd/Au) - Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING - - GULL WING BALL FLAT - GULL WING
Terminal pitch 0.95 mm - - 0.95 mm 0.5 mm 0.5 mm - 0.95 mm
Terminal location DUAL - - DUAL BOTTOM DUAL - DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
width 1.6 mm - - 1.6 mm 0.9 mm 1.2 mm - 1.6 mm

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