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LXP610PE

Description
Telecom Circuit, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28
CategoryWireless rf/communication    Telecom circuit   
File Size335KB,16 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

LXP610PE Overview

Telecom Circuit, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28

LXP610PE Parametric

Parameter NameAttribute value
Parts packaging codeQLCC
package instructionQCCJ, LDCC28,.5SQ
Contacts28
Reach Compliance Codecompliant
JESD-30 codeS-PQCC-J28
length11.5062 mm
Number of functions1
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC28,.5SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply5 V
Certification statusNot Qualified
Maximum seat height4.57 mm
Maximum slew rate14 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width11.5062 mm
Base Number Matches1
DATA SHEET
MARCH 1999
LXP610
Low-Jitter Multi-Rate Clock Adapter (CLAD)
General Description
The LXP610 Multi-Rate Clock Adapter (CLAD) offers
pin-selectable frequency conversion between T1 and E1
rates as well as 8 additional rates from 1.544 MHz to
8.192 MHz. The output clock is frequency-locked to the
input clock. When an input frame sync pulse is provided,
the CLAD phase-locks the input and output clocks
together, and locks the 8 kHz output frame sync pulse to the
input frame sync pulse. The frame sync polarity is also pin-
selectable.
Five different high frequency output clocks are available
for applications which require a higher-than-baud rate
backplane or system clock. The high frequency output
(HFO) clock varies with the input clock frequency.
Level One’s patented locking method enables the CLAD to
perform frequency conversion with no external
components, while generating very little jitter on the output
clock. The conversion is digitally controlled so the output
clock is as accurate as the input clock.
The CLAD is an advanced CMOS device and requires only
a single +5 V power supply.
Revision 1.1
Features
• Translates between 10 different frequencies.
• Generates basic and high frequency output clocks and
frame sync from an input clock and its frame sync.
• High Frequency Output clock for higher-than-baud
rate backplane systems
• Low output jitter meets AT&T Publication 62411 for
1.544 MHz, and ITU Recommendation G.823 for
2.048 MHz
• Digital control of frequency conversion process
• No external components
• Pin-selectable operation mode
• Low-power 5 V only CMOS in 14-pin plastic DIP, 28-
pin PLCC and 16 pin SOIC packages
Applications
• Internal timing system for Channel Banks, Digital
Loop Carriers, Multiplexers, Internal Timing
Generators, etc.
• Conversion between T1/E1 clock rates and higher
frequency backplane rates (T1/E1 converter)
• Special backplane interfaces (e.g. NTI 2.56 MHz)
LXP610 Block Diagram
CLKI
Input
Divider
Analog
Phase-Locked
Loop
Output
Divider
HFO
CLKO
Feedback
Divider
SEL
FSI
P1
P2
P3
P4
Frequency
Converter
Frame Sync
Generator
FSP
FSO
Frequency
Select
Logic
Refer to www.level1.com for most current information.


LXP610PE Related Products

LXP610PE LXP610SE LXP610NE
Description Telecom Circuit, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28 Telecom Circuit, 1-Func, CMOS, PDSO16, SOIC-16 Telecom Circuit, 1-Func, CMOS, PDIP14, PLASTIC, DIP-14
Parts packaging code QLCC SOIC DIP
package instruction QCCJ, LDCC28,.5SQ SOP, DIP, DIP14,.3
Contacts 28 16 14
Reach Compliance Code compliant unknown compliant
JESD-30 code S-PQCC-J28 R-PDSO-G16 R-PDIP-T14
length 11.5062 mm 10.3 mm 19.177 mm
Number of functions 1 1 1
Number of terminals 28 16 14
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ SOP DIP
Package shape SQUARE RECTANGULAR RECTANGULAR
Package form CHIP CARRIER SMALL OUTLINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 2.65 mm 5.334 mm
Nominal supply voltage 5 V 5 V 5 V
surface mount YES YES NO
technology CMOS CMOS CMOS
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form J BEND GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm
Terminal location QUAD DUAL DUAL
width 11.5062 mm 7.5 mm 7.62 mm
Base Number Matches 1 1 1
Encapsulate equivalent code LDCC28,.5SQ - DIP14,.3
power supply 5 V - 5 V
Maximum slew rate 14 mA - 14 mA

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Index Files: 2193  2292  82  428  2237  45  47  2  9  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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