EEWORLDEEWORLDEEWORLD

Part Number

Search

LXP610SE

Description
Telecom Circuit, 1-Func, CMOS, PDSO16, SOIC-16
CategoryWireless rf/communication    Telecom circuit   
File Size335KB,16 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

LXP610SE Overview

Telecom Circuit, 1-Func, CMOS, PDSO16, SOIC-16

LXP610SE Parametric

Parameter NameAttribute value
Parts packaging codeSOIC
package instructionSOP,
Contacts16
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G16
length10.3 mm
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
Maximum seat height2.65 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width7.5 mm
Base Number Matches1
DATA SHEET
MARCH 1999
LXP610
Low-Jitter Multi-Rate Clock Adapter (CLAD)
General Description
The LXP610 Multi-Rate Clock Adapter (CLAD) offers
pin-selectable frequency conversion between T1 and E1
rates as well as 8 additional rates from 1.544 MHz to
8.192 MHz. The output clock is frequency-locked to the
input clock. When an input frame sync pulse is provided,
the CLAD phase-locks the input and output clocks
together, and locks the 8 kHz output frame sync pulse to the
input frame sync pulse. The frame sync polarity is also pin-
selectable.
Five different high frequency output clocks are available
for applications which require a higher-than-baud rate
backplane or system clock. The high frequency output
(HFO) clock varies with the input clock frequency.
Level One’s patented locking method enables the CLAD to
perform frequency conversion with no external
components, while generating very little jitter on the output
clock. The conversion is digitally controlled so the output
clock is as accurate as the input clock.
The CLAD is an advanced CMOS device and requires only
a single +5 V power supply.
Revision 1.1
Features
• Translates between 10 different frequencies.
• Generates basic and high frequency output clocks and
frame sync from an input clock and its frame sync.
• High Frequency Output clock for higher-than-baud
rate backplane systems
• Low output jitter meets AT&T Publication 62411 for
1.544 MHz, and ITU Recommendation G.823 for
2.048 MHz
• Digital control of frequency conversion process
• No external components
• Pin-selectable operation mode
• Low-power 5 V only CMOS in 14-pin plastic DIP, 28-
pin PLCC and 16 pin SOIC packages
Applications
• Internal timing system for Channel Banks, Digital
Loop Carriers, Multiplexers, Internal Timing
Generators, etc.
• Conversion between T1/E1 clock rates and higher
frequency backplane rates (T1/E1 converter)
• Special backplane interfaces (e.g. NTI 2.56 MHz)
LXP610 Block Diagram
CLKI
Input
Divider
Analog
Phase-Locked
Loop
Output
Divider
HFO
CLKO
Feedback
Divider
SEL
FSI
P1
P2
P3
P4
Frequency
Converter
Frame Sync
Generator
FSP
FSO
Frequency
Select
Logic
Refer to www.level1.com for most current information.


LXP610SE Related Products

LXP610SE LXP610PE LXP610NE
Description Telecom Circuit, 1-Func, CMOS, PDSO16, SOIC-16 Telecom Circuit, 1-Func, CMOS, PQCC28, PLASTIC, LCC-28 Telecom Circuit, 1-Func, CMOS, PDIP14, PLASTIC, DIP-14
Parts packaging code SOIC QLCC DIP
package instruction SOP, QCCJ, LDCC28,.5SQ DIP, DIP14,.3
Contacts 16 28 14
Reach Compliance Code unknown compliant compliant
JESD-30 code R-PDSO-G16 S-PQCC-J28 R-PDIP-T14
length 10.3 mm 11.5062 mm 19.177 mm
Number of functions 1 1 1
Number of terminals 16 28 14
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP QCCJ DIP
Package shape RECTANGULAR SQUARE RECTANGULAR
Package form SMALL OUTLINE CHIP CARRIER IN-LINE
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 4.57 mm 5.334 mm
Nominal supply voltage 5 V 5 V 5 V
surface mount YES YES NO
technology CMOS CMOS CMOS
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING J BEND THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL QUAD DUAL
width 7.5 mm 11.5062 mm 7.62 mm
Base Number Matches 1 1 1
Encapsulate equivalent code - LDCC28,.5SQ DIP14,.3
power supply - 5 V 5 V
Maximum slew rate - 14 mA 14 mA

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 440  645  1016  462  2323  9  13  21  10  47 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号