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DPS512X32MFI3-35C

Description
SRAM Module, 512KX32, 35ns, CMOS, CQIP68, 0.269 INCH HEIGHT, STRAIGHT, STACK, HERMETIC SEALED, CERAMIC, SLCC-68
Categorystorage    storage   
File Size812KB,8 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DPS512X32MFI3-35C Overview

SRAM Module, 512KX32, 35ns, CMOS, CQIP68, 0.269 INCH HEIGHT, STRAIGHT, STACK, HERMETIC SEALED, CERAMIC, SLCC-68

DPS512X32MFI3-35C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeQIP
package instructionQIP, QUAD68,.56X.98,40
Contacts68
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time35 ns
Other featuresUSER CONFIGURABLE AS 2M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeR-CQIP-T68
length24.892 mm
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQIP
Encapsulate equivalent codeQUAD68,.56X.98,40
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height7.5438 mm
Maximum standby current0.0012 A
Minimum standby current2 V
Maximum slew rate0.68 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch1.016 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14.224 mm
Base Number Matches1
2Mx8/1Mx16/5Mx32, 20 - 45ns, STACK
30A154-04
A
16 Megabit High Speed CMOS SRAM
DPS512X32MFn3
DESCRIPTION:
The DPS512X32MFn3 High Speed SRAM ‘’STACK’’ modules are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded
packages. The module packs 16-Megabits of low-power CMOS
static RAM in an area as small as 0.549 in
2
, while maintaining a
total height as low as 0.269 inches.
The DPS512X32MFn3 STACK modules contain four individual
512K x 8 SRAMs, each packaged in a hermetically sealed SLCC,
making the modules suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
SLCC Stack
Straight
Leaded
Stack
FEATURES:
Organizations Available:
512K x 32, 1Meg x 16 or 2 Meg x 8
Access Times: 20*, 25, 30, 35, 45ns
Fully Static Operation
- No clock or refresh required
Single +5V Power Supply,
±
10% Tolerance
TTL Compatible
Common Data Inputs and Outputs
Low Data Retention Voltage:
2.0V min.
Packages Available:
SLCC Stack
Straight Leaded Stack
‘’J’’ Leaded Stack
Gullwing Leaded Stack
‘’J’’ Leaded
Stack
Gullwing
Leaded
Stack
*
Commercial and Industrial Grade only.
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A18
I/O0 - I/O31
CE0 - CE3
WE
OE
V
DD
V
SS
N.C.
Address Inputs
Data Input/Output
Low Chip Enables
Write Enable
Output Enable
Power (+5V)
Ground
No Connect
30A154-04
REV. B
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to change products or specifications herein without prior notice.
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