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SN74LVC3G04YEPR

Description
Inverters Triple Inverter Gate
Categorylogic    logic   
File Size305KB,12 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SN74LVC3G04YEPR Overview

Inverters Triple Inverter Gate

SN74LVC3G04YEPR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
Parts packaging codeBGA
package instructionDSBGA-8
Contacts8
Reach Compliance Code_compli
seriesLVC/LCX/Z
JESD-30 codeR-XBGA-B8
JESD-609 codee0
length1.9 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions3
Number of entries1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeVFBGA
Encapsulate equivalent codeBGA8,2X4,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Prop。Delay @ Nom-Su4.1 ns
propagation delay (tpd)7.9 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width0.9 mm

SN74LVC3G04YEPR Related Products

SN74LVC3G04YEPR SN74LVC3G04YEAR SN74LVC3G04YZAR
Description Inverters Triple Inverter Gate Inverters Triple Inverters Triple Inverter Gate
Is it Rohs certified? incompatible incompatible conform to
Maker Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA DSBGA DSBGA
package instruction DSBGA-8 MO-211EB, DSBGA-8 GREEN, MO-211EB, DSBGA-8
Contacts 8 8 8
Reach Compliance Code _compli _compli unknow
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-XBGA-B8 R-XBGA-B8 R-XBGA-B8
JESD-609 code e0 e0 e1
length 1.9 mm 1.9 mm 1.9 mm
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type INVERTER INVERTER INVERTER
MaximumI(ol) 0.024 A 0.024 A 0.024 A
Humidity sensitivity level 1 1 1
Number of functions 3 3 3
Number of entries 1 1 1
Number of terminals 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code VFBGA VFBGA VFBGA
Encapsulate equivalent code BGA8,2X4,20 BGA8,2X4,20 BGA8,2X4,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Su 4.1 ns 4.1 ns 4.1 ns
propagation delay (tpd) 7.9 ns 7.9 ns 7.9 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Maximum seat height 0.5 mm 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 0.9 mm 0.9 mm 0.9 mm
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