|
SN74LVC3G04YZAR |
SN74LVC3G04YEAR |
SN74LVC3G04YEPR |
| Description |
Inverters Triple Inverter Gate |
Inverters Triple |
Inverters Triple Inverter Gate |
| Is it Rohs certified? |
conform to |
incompatible |
incompatible |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
DSBGA |
DSBGA |
BGA |
| package instruction |
GREEN, MO-211EB, DSBGA-8 |
MO-211EB, DSBGA-8 |
DSBGA-8 |
| Contacts |
8 |
8 |
8 |
| Reach Compliance Code |
unknow |
_compli |
_compli |
| series |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
| JESD-30 code |
R-XBGA-B8 |
R-XBGA-B8 |
R-XBGA-B8 |
| JESD-609 code |
e1 |
e0 |
e0 |
| length |
1.9 mm |
1.9 mm |
1.9 mm |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
| Logic integrated circuit type |
INVERTER |
INVERTER |
INVERTER |
| MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
| Humidity sensitivity level |
1 |
1 |
1 |
| Number of functions |
3 |
3 |
3 |
| Number of entries |
1 |
1 |
1 |
| Number of terminals |
8 |
8 |
8 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
| encapsulated code |
VFBGA |
VFBGA |
VFBGA |
| Encapsulate equivalent code |
BGA8,2X4,20 |
BGA8,2X4,20 |
BGA8,2X4,20 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
3.3 V |
3.3 V |
3.3 V |
| Prop。Delay @ Nom-Su |
4.1 ns |
4.1 ns |
4.1 ns |
| propagation delay (tpd) |
7.9 ns |
7.9 ns |
7.9 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Schmitt trigger |
NO |
NO |
NO |
| Maximum seat height |
0.5 mm |
0.5 mm |
0.5 mm |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
1.65 V |
1.65 V |
1.65 V |
| Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
BALL |
BALL |
BALL |
| Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
0.9 mm |
0.9 mm |
0.9 mm |