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BZX85B18-AP

Description
Zener Diode, 18V V(Z), 2%, 1.3W, Silicon, Unidirectional, DO-41, ROHS COMPLIANT, DO-41G, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size438KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
Download Datasheet Parametric View All

BZX85B18-AP Overview

Zener Diode, 18V V(Z), 2%, 1.3W, Silicon, Unidirectional, DO-41, ROHS COMPLIANT, DO-41G, 2 PIN

BZX85B18-AP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeDO-41
package instructionROHS COMPLIANT, DO-41G, 2 PIN
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresLOW NOISE
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-41
JESD-30 codeO-XALF-W2
JESD-609 codee3
Number of components1
Number of terminals2
Package body materialUNSPECIFIED
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1.3 W
Certification statusNot Qualified
Nominal reference voltage18 V
surface mountNO
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formWIRE
Terminal locationAXIAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance2%
Working test current15 mA
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla
Street Chatsworth

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$ %    !"#
BZX85C
Series
Features
Low noise and Low reverse current
Very high stability
Very sharp reverse characteristic
Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Maximum Ratings
Operating Temperature: -65℃ to +175℃
Storage Temperature: -65℃ to +175℃
DC Power Dissipation: 1.3 Watt @ L=4mm T
L
≦25℃
Forward Voltage @ 200mA: 1.0 Volts
Thermal Resistance: 110K/W Junction to Ambient
Figure1. Power Dissipation vs. Ambient Temperature
Ptot –Total Power Dissipation (W)
1.3 Watt
Zener Diode
2.7 to
75
Volts
DO-41G
D
A
Cathode
Mark
B
D
Tamb – Ambient Temperature(℃)
C
Figure2. Thermal Resistance vs. Lead Length
R
thJA
– Therm. Resist. Junction/
Ambient (K/W)
DIMENSIONS
INCHES
MIN
.166
.080
.028
1.000
MM
MIN
4.10
2.00
.70
25.40
DIM
A
B
C
D
MAX
.205
.107
.034
---
MAX
5.20
2.70
.90
---
NOTE
L– Lead Length (mm)
Note:
1.
Lead in Glass Solder Exemption Applied, see EU Directive Annex 5.
www.mccsemi.com
Revision: 6
1 of 3
2008/01/30
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