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SP8611BDG

Description
asynchronous ECL divide
Categorylogic    logic   
File Size175KB,9 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Download Datasheet Parametric Compare View All

SP8611BDG Overview

asynchronous ECL divide

SP8611BDG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZarlink Semiconductor (Microsemi)
package instructionDIP,
Reach Compliance Codeunknow
series8611
JESD-30 codeR-GDIP-T14
JESD-609 codee0
Logic integrated circuit typePRESCALER
Number of data/clock inputs1
Number of functions1
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristicsEMITTER FOLLOWER
Output polarityCOMPLEMENTARY
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5.08 mm
surface mountNO
technologyECL
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
minfmax1500 MHz
Base Number Matches1
Obsolescence Notice
This product is obsolete.
This information is available for your
convenience only.
For more information on
Zarlink’s obsolete products and
replacement product lists, please visit
http://products.zarlink.com/obsolete_products/

SP8611BDG Related Products

SP8611BDG SP8610 SP8610AADG SP8610ADG SP8610BDG SP8610NA1C SP8611 SP8611AADG SP8611ADG SP8611NA1C
Description asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible - incompatible incompatible incompatible
Maker Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction DIP, - DIP, DIP, DIP, DIE, - DIP, DIP, DIE,
Reach Compliance Code unknow - unknow unknow unknow unknow - unknow unknow unknow
series 8611 - 8610 8610 8610 8610 - 8611 8611 8611
JESD-30 code R-GDIP-T14 - R-GDIP-T14 R-GDIP-T14 R-GDIP-T14 X-XUUC-N - R-GDIP-T14 R-GDIP-T14 X-XUUC-N
JESD-609 code e0 - e0 e0 e0 e0 - e0 e0 e0
Logic integrated circuit type PRESCALER - PRESCALER PRESCALER PRESCALER PRESCALER - PRESCALER PRESCALER PRESCALER
Number of data/clock inputs 1 - 1 1 1 1 - 1 1 1
Number of functions 1 - 1 1 1 1 - 1 1 1
Number of terminals 14 - 14 14 14 - - 14 14 -
Maximum operating temperature 70 °C - 125 °C 110 °C 70 °C 125 °C - 125 °C 110 °C 125 °C
Minimum operating temperature - - -55 °C -55 °C - -55 °C - -55 °C -55 °C -55 °C
Output characteristics EMITTER FOLLOWER - EMITTER FOLLOWER EMITTER FOLLOWER EMITTER FOLLOWER EMITTER FOLLOWER - EMITTER FOLLOWER EMITTER FOLLOWER EMITTER FOLLOWER
Output polarity COMPLEMENTARY - COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY - COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
Package body material CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED UNSPECIFIED - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED UNSPECIFIED
encapsulated code DIP - DIP DIP DIP DIE - DIP DIP DIE
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED - RECTANGULAR RECTANGULAR UNSPECIFIED
Package form IN-LINE - IN-LINE IN-LINE IN-LINE UNCASED CHIP - IN-LINE IN-LINE UNCASED CHIP
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm - 5.08 mm 5.08 mm 5.08 mm - - 5.08 mm 5.08 mm -
surface mount NO - NO NO NO YES - NO NO YES
technology ECL - ECL ECL ECL ECL - ECL ECL ECL
Temperature level COMMERCIAL - MILITARY OTHER COMMERCIAL MILITARY - MILITARY OTHER MILITARY
Terminal surface TIN LEAD - TIN LEAD TIN LEAD TIN LEAD TIN LEAD - TIN LEAD TIN LEAD TIN LEAD
Terminal form THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD - THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm - 2.54 mm 2.54 mm 2.54 mm - - 2.54 mm 2.54 mm -
Terminal location DUAL - DUAL DUAL DUAL UPPER - DUAL DUAL UPPER
width 7.62 mm - 7.62 mm 7.62 mm 7.62 mm - - 7.62 mm 7.62 mm -
minfmax 1500 MHz - 1000 MHz 1000 MHz 1000 MHz 1000 MHz - 1300 MHz 1300 MHz 1300 MHz

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