EEWORLDEEWORLDEEWORLD

Part Number

Search

SP8610BDG

Description
asynchronous ECL divide
Categorylogic    logic   
File Size175KB,9 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Download Datasheet Parametric Compare View All

SP8610BDG Overview

asynchronous ECL divide

SP8610BDG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZarlink Semiconductor (Microsemi)
package instructionDIP,
Reach Compliance Codeunknow
series8610
JESD-30 codeR-GDIP-T14
JESD-609 codee0
Logic integrated circuit typePRESCALER
Number of data/clock inputs1
Number of functions1
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristicsEMITTER FOLLOWER
Output polarityCOMPLEMENTARY
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5.08 mm
surface mountNO
technologyECL
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
minfmax1000 MHz
Obsolescence Notice
This product is obsolete.
This information is available for your
convenience only.
For more information on
Zarlink’s obsolete products and
replacement product lists, please visit
http://products.zarlink.com/obsolete_products/

SP8610BDG Related Products

SP8610BDG SP8610 SP8610AADG SP8610ADG SP8610NA1C SP8611 SP8611AADG SP8611ADG SP8611BDG SP8611NA1C
Description asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide asynchronous ECL divide
Is it Rohs certified? incompatible - incompatible incompatible incompatible - incompatible incompatible incompatible incompatible
Maker Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction DIP, - DIP, DIP, DIE, - DIP, DIP, DIP, DIE,
Reach Compliance Code unknow - unknow unknow unknow - unknow unknow unknow unknow
series 8610 - 8610 8610 8610 - 8611 8611 8611 8611
JESD-30 code R-GDIP-T14 - R-GDIP-T14 R-GDIP-T14 X-XUUC-N - R-GDIP-T14 R-GDIP-T14 R-GDIP-T14 X-XUUC-N
JESD-609 code e0 - e0 e0 e0 - e0 e0 e0 e0
Logic integrated circuit type PRESCALER - PRESCALER PRESCALER PRESCALER - PRESCALER PRESCALER PRESCALER PRESCALER
Number of data/clock inputs 1 - 1 1 1 - 1 1 1 1
Number of functions 1 - 1 1 1 - 1 1 1 1
Number of terminals 14 - 14 14 - - 14 14 14 -
Maximum operating temperature 70 °C - 125 °C 110 °C 125 °C - 125 °C 110 °C 70 °C 125 °C
Minimum operating temperature - - -55 °C -55 °C -55 °C - -55 °C -55 °C - -55 °C
Output characteristics EMITTER FOLLOWER - EMITTER FOLLOWER EMITTER FOLLOWER EMITTER FOLLOWER - EMITTER FOLLOWER EMITTER FOLLOWER EMITTER FOLLOWER EMITTER FOLLOWER
Output polarity COMPLEMENTARY - COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY - COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
Package body material CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED UNSPECIFIED - CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED UNSPECIFIED
encapsulated code DIP - DIP DIP DIE - DIP DIP DIP DIE
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR UNSPECIFIED - RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED
Package form IN-LINE - IN-LINE IN-LINE UNCASED CHIP - IN-LINE IN-LINE IN-LINE UNCASED CHIP
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm - 5.08 mm 5.08 mm - - 5.08 mm 5.08 mm 5.08 mm -
surface mount NO - NO NO YES - NO NO NO YES
technology ECL - ECL ECL ECL - ECL ECL ECL ECL
Temperature level COMMERCIAL - MILITARY OTHER MILITARY - MILITARY OTHER COMMERCIAL MILITARY
Terminal surface TIN LEAD - TIN LEAD TIN LEAD TIN LEAD - TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE NO LEAD - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm - 2.54 mm 2.54 mm - - 2.54 mm 2.54 mm 2.54 mm -
Terminal location DUAL - DUAL DUAL UPPER - DUAL DUAL DUAL UPPER
width 7.62 mm - 7.62 mm 7.62 mm - - 7.62 mm 7.62 mm 7.62 mm -
minfmax 1000 MHz - 1000 MHz 1000 MHz 1000 MHz - 1300 MHz 1300 MHz 1500 MHz 1300 MHz
ADS1299 Pinout Q&A
Q:227517227518227518[/attach] Question 1: As shown in the box 1 in the figure above, is it OK to connect the right leg circuit like this? BIASREF is left floating. Is this OK? Question 2: As shown in ...
maylove Analogue and Mixed Signal
Analysis of the current level and development trend of the domestic and foreign instrumentation industry
2009-10 来源:中国仪器仪表行业协会  仪器仪表行业是我国发展的新型行业,在与国际接轨的同时,我国的仪器仪表行业发展有了长足的进步空间具备了与国际竞争的实力。[b]  国内科技目前水平及发展趋势[/b]  仪器仪表行业整体综合技术水平达到国际80年代中期水平,微电子技术和计算机技术在仪器仪表产品中普遍采用,约15%的产品实现了智能化,达到国际90 年代水平;30%的产品实现了数字化,达到国际...
cscl Test/Measurement
What is the function of T3 in the data link layer of the MAP27 protocol?
As the title says: What is the function of T3 in the data link layer of the MAP27 protocol? ? Can anyone who knows explain it in detail?...
asterli Embedded System
Texas Instruments popular information articles sharing
1. Summary of some practical experience in power supply design 2. For digital engineers using FPGA 3. PCB layout tips for Fly-Buck converters 4. About electrical overstress, must read [/color] [url=ht...
电路艺术 TI Technology Forum
Looking for a counting and decoding film
I want to ask if there is a chip like cd4017, but can at least count 12 numbers?If not, how to cascade it? (I don't want the 4017 with 12-pin carry)...
kfkxt MCU
Study lm3s8962 uart reading GPS data experiment
The GPS module selects a module with standard ttl level NMEA standard output. This experiment only reads the received data without parsing. The program with parsing exceeds the keil 32k limit. Since t...
ssawee Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1099  2737  2112  2571  2703  23  56  43  52  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号