asynchronous ECL divide
| SP8610 | SP8610AADG | SP8610ADG | SP8610BDG | SP8610NA1C | SP8611 | SP8611AADG | SP8611ADG | SP8611BDG | SP8611NA1C | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide | asynchronous ECL divide |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | - | incompatible | incompatible | incompatible | incompatible |
| Maker | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
| package instruction | - | DIP, | DIP, | DIP, | DIE, | - | DIP, | DIP, | DIP, | DIE, |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | - | unknow | unknow | unknow | unknow |
| series | - | 8610 | 8610 | 8610 | 8610 | - | 8611 | 8611 | 8611 | 8611 |
| JESD-30 code | - | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | X-XUUC-N | - | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | X-XUUC-N |
| JESD-609 code | - | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | - | PRESCALER | PRESCALER | PRESCALER | PRESCALER | - | PRESCALER | PRESCALER | PRESCALER | PRESCALER |
| Number of data/clock inputs | - | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| Number of functions | - | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | 14 | 14 | 14 | - | - | 14 | 14 | 14 | - |
| Maximum operating temperature | - | 125 °C | 110 °C | 70 °C | 125 °C | - | 125 °C | 110 °C | 70 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | - | -55 °C | - | -55 °C | -55 °C | - | -55 °C |
| Output characteristics | - | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER | - | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER |
| Output polarity | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| Package body material | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
| encapsulated code | - | DIP | DIP | DIP | DIE | - | DIP | DIP | DIP | DIE |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| Package form | - | IN-LINE | IN-LINE | IN-LINE | UNCASED CHIP | - | IN-LINE | IN-LINE | IN-LINE | UNCASED CHIP |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | 5.08 mm | 5.08 mm | 5.08 mm | - | - | 5.08 mm | 5.08 mm | 5.08 mm | - |
| surface mount | - | NO | NO | NO | YES | - | NO | NO | NO | YES |
| technology | - | ECL | ECL | ECL | ECL | - | ECL | ECL | ECL | ECL |
| Temperature level | - | MILITARY | OTHER | COMMERCIAL | MILITARY | - | MILITARY | OTHER | COMMERCIAL | MILITARY |
| Terminal surface | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | - | - | 2.54 mm | 2.54 mm | 2.54 mm | - |
| Terminal location | - | DUAL | DUAL | DUAL | UPPER | - | DUAL | DUAL | DUAL | UPPER |
| width | - | 7.62 mm | 7.62 mm | 7.62 mm | - | - | 7.62 mm | 7.62 mm | 7.62 mm | - |
| minfmax | - | 1000 MHz | 1000 MHz | 1000 MHz | 1000 MHz | - | 1300 MHz | 1300 MHz | 1500 MHz | 1300 MHz |
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