Freescale Semiconductor
Technical Data
Document Number: MC33291L
Rev. 5.0, 9/2008
Eight-Output Switch with Serial
Peripheral Interface I/O
The 33291L device is an eight-output, low-side power switch with 8-
bit serial input control. The 33291L is a versatile circuit designed for
automotive applications, but is well suited for other environments. The
33291L incorporates SMARTMOS technology, with CMOS logic,
bipolar/MOS analog circuitry, and DMOS power MOSFETs. The
33291L interfaces directly with a microcontroller to control various
inductive or incandescent loads.
The circuit’s innovative monitoring and protection features include
very low standby current, SPI cascade fault reporting capability,
internal 53 V clamp on each output, output-specific diagnostics, and
independent shutdown of outputs.
The device is parametrically specified over an ambient temperature
range of -40°C
≤
T
A
≤
125°C and 9.0 V
≤
V
PWR
≤
16 V supply.
Features
• Designed to Operate Over Wide Supply Voltages of 5.5 V to 26.5 V
• Interfaces to Microprocessor Using 8-Bit SPI I/O Protocol up to 3.0
MHz
• 1.0 A Peak Current Outputs with Maximum R
DS(ON)
of 1.6
Ω
at T
J
-
150°C
• Outputs Current-Limited to Accommodate In-Rush Currents
Associated with Switching Incandescent Loads
• Output Voltages Clamped to 53 V During Inductive Switching
• Maximum Sleep Current (I
PWR
) of 25
μA
• Maximum of 4.0 mA I
DD
During Operation
• Pb-Free Packaging Designated by Suffix Code EG
33291L
LOW-SIDE SWITCH
DW SUFFIX
EG SUFFIX (PB-FREE)
98ASB42344B
24-PIN SOICW
ORDERING INFORMATION
Device
MC33291LDW/R2
MCZ33291LEG/R2
Temperature
Range (T
A
)
-40
°
C to 125
°
C
Package
24 SOICW
VDD
V PWR
33291L
VPWR
SFPD
VDD
CS
MCU
SCLK
SI
SO
RESET
OP 0
OP 1
OP 2
OP 3
OP 4
OP 5
OP 6
OP 7
GND
Figure 1. 33291L Simplified Application Schematic
Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as
may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2007 - 2008. All rights reserved.
V
PWR
21
Output 0
Over-
voltage
Voltage
Regulator
GE
OVD
OT
VDD
SF
RB
OF
SFPD
SFL
CS
SPI
SCLK
Interface
SI
Logic
SO
CSI
CSBI
24
Bias
53 V
PIN
16
SFPD
15
RST
22
CS
10
SCLK
3
SI
4
SO
9
+
10
μA
25
μA
+
10
μA
Fault Timers
10
μA
+
10
μA
Gate
Control
To Gates
1–7
Outputs
1, 2, 11–14, 23
Open
Load
Detect
lLimit
Short
Circuit
Detect
+
-
RS
Serial D/O
Line Driver
Over-
temperature
Detect
From Detectors 1–7
Grounds
5–8, 17–20
Figure 2. 33291L Simplified Block Diagram
Table 1. Fault Operation
SERIAL OUTPUT (SO) PIN REPORTS
Overvoltage
Overtemperature
Overcurrent
Output ON, Open Load Fault
Output OFF, Open Load Fault
DEVICE SHUTDOWNS
Overvoltage
Overtemperature
Overcurrent
Total device shutdown at V
PWR
= 28 V to 36 V. All outputs are latched off while the SPI register is reset
(cleared). Outputs can be turned back on with a new SPI command after V
PWR
has decayed below 26.5 V.
Only the output experiencing an overtemperature condition turns OFF.
Only the output experiencing an overcurrent shuts down at 1.0 A to 3.0 A after a 70
μ
s to 250
μ
s delay, with
SFPD pin grounded. All other outputs will continue to operate in a current limit mode with no shutdown if the
SFPD pin is at 5.0 V (so long as the individual outputs are not experiencing thermal limit conditions).
Overvoltage condition reported.
Fault reported by Serial Output (SO) pin.
SO pin reports short to battery/supply or overcurrent condition.
Not reported.
SO pin reports output OFF open load condition.
33291L
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
OP7
OP6
SCLK
SI
GND
GND
GND
GND
SO
CS
OP5
OP4
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
OP0
OP1
RST
VPWR
GND
GND
GND
GND
VDD
SFPD
OP2
OP3
Figure 3. 33291L Pin Connections
Table 2. 33291L Pin Definitions
PIN
NUMBER
1
2
3
4
5 – 8, 17 – 20
9
10
11
12
13
14
15
16
21
22
23
24
PIN NAME
OP7
OP6
SCLK
SI
GND
SO
CS
OP5
OP4
OP3
OP2
SFPD
V
DD
V
PWR
RST
OP1
OP0
FORMAL NAME
Output 7
Output 6
System Clock
Serial Input
Ground
Serial Output
Chip Select
Output 5
Output 4
Output 3
Output 2
Short Fault
Protect Disable
Logic Supply
Output MOSFET
Gate Drive Supply
Reset
Output 1
Output 0
DEFINITION
Connection to drain of output MOSFET number seven.
Connection to drain of output MOSFET number six.
Clocks the internal Shift registers of the 33291L.
This pin is for the input of serial instruction data. SI information is read on the falling
edge of SCLK.
Connection to IC Power Ground and functions as part of heat sinking path.
Tri-stateable output from the Shift register.
Whenever this pin is in a logic low state, data can be transferred from the MCU to
the 33291L through the SI pin and from the 33291L to the MCU through the SO pin.
Connection to drain of output MOSFET number five.
Connection to drain of output MOSFET number four.
Connection to drain of output MOSFET number three.
Connection to drain of output MOSFET number two.
This pin is used to prevent the outputs from latching-OFF because of an overcurrent
condition.
Plus supply for logic.
Main power supply.
This pin is active low. It is used to clear the SPI Shift register, thereby setting all
output switches OFF
.
Connection to drain of output MOSFET number one.
Connection to drain of output MOSFET number zero.
33291L
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Power Supply Voltage
Normal Operation (Steady-State)
Transient Conditions
(1)
Logic Supply Voltage
(2)
Input Pin Voltage
(3)
Output Clamp Voltage
(4)
5.0 mA
≤
I
OUT
≤
0.5 A
Output Self-Limit Current
Continuous Per Output Current
(5)
ESD Voltage
(6) (7)
Human Body Model
Machine Model
Output Clamp Energy
(8)
Recommended Frequency of SPI Operation
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Power Dissipation (
T
A
= 25
°
C)
(9)
V
ESD1
V
ESD2
E
CLAMP
f
SPI
T
STG
T
C
T
J
P
D
±2000
±200
50
3.0
-55 to 150
-40 to 125
-40 to 150
2.0
mJ
MHz
I
OUT(LIM)
I
OUT(CONT)
V
PWR(SUS)
V
PWR(PK)
V
DD
V
IN
V
OUT(OFF)
45 to 65
1.0 to 3.0
500
A
mA
V
-1.5 to 26.5
-13 to 60
-0.3 to 7.0
-0.3 to 7.0
V
V
V
Symbol
Value
Unit
V
°
C
°
C
°
C
W
Notes
1. Transient capability with external 100
Ω
resistor in series with V
PWR
pin and supply.
2.
3.
4.
5.
6.
7.
8.
9.
Exceeding these limits may cause a malfunction or permanent damage to the device.
Exceeding the limits on SCLK, SI,
CS
, SFPD, or
RST
pins may cause permanent damage to the device.
With output OFF.
Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125
°
C ambient temperature
will require maximum output current computation using package R
θ
JA.
ESD data available upon request.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 200 pF, R
ZAP
= 1500
Ω),
ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 200pF, R
ZAP
= 0
Ω).
Maximum output clamp energy capability at 150
°
C junction temperature using a single non-repetitive pulse method.
Maximum power dissipation at indicated junction temperature with no heat sink used.
33291L
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Peak Package Reflow Temperature During Reflow
(10)
,
(11)
Thermal Resistance
All Outputs ON
(12)
Single Output ON
(13)
Symbol
T
PPRT
R
θ
JA
60
45
Value
Note 11.
Unit
°C
°C/W
Notes
10. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
11. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
12. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
13. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
33291L
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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