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HN58X25128IAG

Description
Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
File Size237KB,22 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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HN58X25128IAG Overview

Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory

HN58X25128IAG
HN58X25256IAG
Serial Peripheral Interface
128k EEPROM (16-kword
×
8-bit)
256k EEPROM (32-kword
×
8-bit)
Electrically Erasable and Programmable Read Only Memory
REJ03C0307-0100
Rev.1.00
Nov.30.2006
Description
HN58X25xxx Series is the Serial Peripheral Interface compatible (SPI) EEPROM (Electrically Erasable and
Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by employing
advanced MONOS memory technology and CMOS process and low voltage circuitry technology. It also has a 64-byte
page programming function to make it’s write operation faster.
Features
Single supply: 1.8 V to 5.5 V
Serial Peripheral Interface compatible (SPI bus)
SPI mode 0 (0,0), 3 (1,1)
Clock frequency: 5 MHz (2.5 V to 5.5 V), 3 MHz (1.8 V to 5.5 V)
Power dissipation:
Standby: 3
µA
(max)
Active (Read): 4 mA (max)
Active (Write): 4 mA (max)
Automatic page write: 64-byte/page
Write cycle time: 5 ms (2.5 V min), 8 ms (1.8 V min)
Endurance: 10
6
Erase/Write Cycles
Data retention: 10 Years
Small size packages: SOP-8pin and TSSOP-14pin
Shipping tape and reel
TSSOP-14pin : 2,000 IC/reel
SOP-8pin
: 2,500 IC/reel
Temperature range:
−40
to
+85°C
Lead free product.
Rev.1.00, Nov.30.2006, page 1 of 20

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HN58X25128IAG HN58X25128FPIAG HN58X25256FPIAG HN58X25128TIAG HN58X25256TIAG
Description Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
Is it lead-free? - Lead free Lead free Lead free Lead free
Is it Rohs certified? - conform to conform to conform to conform to
Parts packaging code - SOIC SOIC SOIC SOIC
package instruction - SOP, SOP8,.25 3.90 X 4.89 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-8 TSSOP, TSSOP14,.25 TSSOP, TSSOP14,.25
Contacts - 8 8 8 8
Reach Compliance Code - unknow compli compli compli
ECCN code - EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) - 3 MHz 3 MHz 3 MHz 3 MHz
Data retention time - minimum - 10 10 10 10
Durability - 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 code - R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
length - 4.89 mm 4.89 mm 4.4 mm 4.4 mm
memory density - 131072 bi 262144 bi 131072 bi 262144 bi
Memory IC Type - EEPROM EEPROM EEPROM EEPROM
memory width - 8 8 8 8
Humidity sensitivity level - 1 1 1 -
Number of functions - 1 1 1 1
Number of terminals - 8 8 8 8
word count - 16384 words 32768 words 16384 words 32768 words
character code - 16000 32000 16000 32000
Operating mode - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C
organize - 16KX8 32KX8 16KX8 32KX8
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP SOP TSSOP TSSOP
Encapsulate equivalent code - SOP8,.25 SOP8,.25 TSSOP14,.25 TSSOP14,.25
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial - SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) - 260 260 260 NOT SPECIFIED
power supply - 2/5 V 2/5 V 2/5 V 2/5 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 1.73 mm 1.73 mm 1.1 mm 1.1 mm
Serial bus type - SPI SPI SPI SPI
Maximum standby current - 0.000003 A 0.000003 A 0.000003 A 0.000003 A
Maximum slew rate - 0.004 mA 0.004 mA 0.004 mA 0.004 mA
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 1.8 V 1.8 V 1.8 V 1.8 V
surface mount - YES YES YES YES
technology - CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - GULL WING GULL WING GULL WING GULL WING
Terminal pitch - 1.27 mm 1.27 mm 0.65 mm 0.65 mm
Terminal location - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - 20 20 20 NOT SPECIFIED
width - 3.9 mm 3.9 mm 3 mm 3 mm
Maximum write cycle time (tWC) - 8 ms 8 ms 8 ms 8 ms
write protect - HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches - 1 1 - 1
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