HN58X2532TIAG datasheet, PDF - EEWORLD Datasheet

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HN58X2532TIAG: DescriptionSerial Peripheral Interface Electrically Erasable and Programmable Read Only Memory; Categorystorage storage; File Size236KB，22 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HN58X2532TIAG Overview

Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory

HN58X2532TIAG Parametric

Parameter Name	Attribute value
Maker	Renesas Electronics Corporation
Parts packaging code	SOIC
package instruction	TSSOP,
Contacts	8
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum clock frequency (fCLK)	3 MHz
JESD-30 code	R-PDSO-G8
length	4.4 mm
memory density	32768 bi
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	4096 words
character code	4000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL
Certification status	Not Qualified
Maximum seat height	1.1 mm
Serial bus type	SPI
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
width	3 mm
Maximum write cycle time (tWC)	8 ms

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HN58X2532IAG

HN58X2564IAG

Serial Peripheral Interface

32k EEPROM (4-kword

8-bit)

64k EEPROM (8-kword

8-bit)

Electrically Erasable and Programmable Read Only Memory

REJ03C0306-0100

Rev.1.00

Nov.16.2006

Description

HN58X25xxx Series is the Serial Peripheral Interface compatible (SPI) EEPROM (Electrically Erasable and

Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by employing

advanced MONOS memory technology and CMOS process and low voltage circuitry technology. It also has a 32-byte

page programming function to make it’s write operation faster.

Features

•

Single supply: 1.8 V to 5.5 V

•

Serial Peripheral Interface compatible (SPI bus)



SPI mode 0 (0,0), 3 (1,1)

•

Clock frequency: 5 MHz (2.5 V to 5.5 V), 3 MHz (1.8 V to 5.5 V)

•

Power dissipation:



Standby: 3

µA

(max)



Active (Read): 3.0 mA (max)



Active (Write): 3.5 mA (max)

•

Automatic page write: 32-byte/page

•

Write cycle time: 5 ms (2.5 V min), 8 ms (1.8 V min)

•

Endurance: 10

Erase/Write Cycles

•

Data retention: 10 Years

•

Small size packages: SOP-8pin, TSSOP-8pin

•

Shipping tape and reel



TSSOP-8pin : 3,000 IC/reel



SOP-8pin

: 2,500 IC/reel

•

Temperature range:

−40

+85°C

•

Lead free product.

Rev.1.00, Nov.16.2006, page 1 of 20

HN58X2532TIAG Related Products

	HN58X2532TIAG	HN58X2532FPIAG	HN58X2532IAG	HN58X2564FPIAG	HN58X2564TIAG
Description	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory	Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	-	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	SOIC	SOIC	-	SOIC	SOIC
package instruction	TSSOP,	SOP,	-	SOP,	TSSOP,
Contacts	8	8	-	8	8
Reach Compliance Code	unknow	unknown	-	unknow	unknow
ECCN code	EAR99	EAR99	-	EAR99	EAR99
Maximum clock frequency (fCLK)	3 MHz	3 MHz	-	3 MHz	3 MHz
JESD-30 code	R-PDSO-G8	R-PDSO-G8	-	R-PDSO-G8	R-PDSO-G8
length	4.4 mm	4.89 mm	-	4.89 mm	4.4 mm
memory density	32768 bi	32768 bit	-	65536 bi	65536 bi
Memory IC Type	EEPROM	EEPROM	-	EEPROM	EEPROM
memory width	8	8	-	8	8
Number of functions	1	1	-	1	1
Number of terminals	8	8	-	8	8
word count	4096 words	4096 words	-	8192 words	8192 words
character code	4000	4000	-	8000	8000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C
organize	4KX8	4KX8	-	8KX8	8KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SOP	-	SOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	-	SERIAL	SERIAL
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	1.1 mm	1.73 mm	-	1.73 mm	1.1 mm
Serial bus type	SPI	SPI	-	SPI	SPI
Maximum supply voltage (Vsup)	5.5 V	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	-	1.8 V	1.8 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	-	2.5 V	2.5 V
surface mount	YES	YES	-	YES	YES
technology	CMOS	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	-	GULL WING	GULL WING
Terminal pitch	0.65 mm	1.27 mm	-	1.27 mm	0.65 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL
width	3 mm	3.9 mm	-	3.9 mm	3 mm
Maximum write cycle time (tWC)	8 ms	8 ms	-	8 ms	8 ms

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