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HN58X2564TIAG

Description
Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
Categorystorage    storage   
File Size236KB,22 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HN58X2564TIAG Overview

Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory

HN58X2564TIAG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
MakerRenesas Electronics Corporation
Parts packaging codeSOIC
package instructionTSSOP,
Contacts8
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum clock frequency (fCLK)3 MHz
JESD-30 codeR-PDSO-G8
length4.4 mm
memory density65536 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count8192 words
character code8000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.1 mm
Serial bus typeSPI
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width3 mm
Maximum write cycle time (tWC)8 ms
HN58X2532IAG
HN58X2564IAG
Serial Peripheral Interface
32k EEPROM (4-kword
×
8-bit)
64k EEPROM (8-kword
×
8-bit)
Electrically Erasable and Programmable Read Only Memory
REJ03C0306-0100
Rev.1.00
Nov.16.2006
Description
HN58X25xxx Series is the Serial Peripheral Interface compatible (SPI) EEPROM (Electrically Erasable and
Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by employing
advanced MONOS memory technology and CMOS process and low voltage circuitry technology. It also has a 32-byte
page programming function to make it’s write operation faster.
Features
Single supply: 1.8 V to 5.5 V
Serial Peripheral Interface compatible (SPI bus)
SPI mode 0 (0,0), 3 (1,1)
Clock frequency: 5 MHz (2.5 V to 5.5 V), 3 MHz (1.8 V to 5.5 V)
Power dissipation:
Standby: 3
µA
(max)
Active (Read): 3.0 mA (max)
Active (Write): 3.5 mA (max)
Automatic page write: 32-byte/page
Write cycle time: 5 ms (2.5 V min), 8 ms (1.8 V min)
Endurance: 10
6
Erase/Write Cycles
Data retention: 10 Years
Small size packages: SOP-8pin, TSSOP-8pin
Shipping tape and reel
TSSOP-8pin : 3,000 IC/reel
SOP-8pin
: 2,500 IC/reel
Temperature range:
−40
to
+85°C
Lead free product.
Rev.1.00, Nov.16.2006, page 1 of 20

HN58X2564TIAG Related Products

HN58X2564TIAG HN58X2532FPIAG HN58X2532IAG HN58X2564FPIAG HN58X2532TIAG
Description Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory
Maker Renesas Electronics Corporation Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code SOIC SOIC - SOIC SOIC
package instruction TSSOP, SOP, - SOP, TSSOP,
Contacts 8 8 - 8 8
Reach Compliance Code unknow unknown - unknow unknow
ECCN code EAR99 EAR99 - EAR99 EAR99
Maximum clock frequency (fCLK) 3 MHz 3 MHz - 3 MHz 3 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 - R-PDSO-G8 R-PDSO-G8
length 4.4 mm 4.89 mm - 4.89 mm 4.4 mm
memory density 65536 bi 32768 bit - 65536 bi 32768 bi
Memory IC Type EEPROM EEPROM - EEPROM EEPROM
memory width 8 8 - 8 8
Number of functions 1 1 - 1 1
Number of terminals 8 8 - 8 8
word count 8192 words 4096 words - 8192 words 4096 words
character code 8000 4000 - 8000 4000
Operating mode SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C - 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C - -40 °C -40 °C
organize 8KX8 4KX8 - 8KX8 4KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP - SOP TSSOP
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL - SERIAL SERIAL
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 1.1 mm 1.73 mm - 1.73 mm 1.1 mm
Serial bus type SPI SPI - SPI SPI
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V - 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V - 2.5 V 2.5 V
surface mount YES YES - YES YES
technology CMOS CMOS - CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING - GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm - 1.27 mm 0.65 mm
Terminal location DUAL DUAL - DUAL DUAL
width 3 mm 3.9 mm - 3.9 mm 3 mm
Maximum write cycle time (tWC) 8 ms 8 ms - 8 ms 8 ms
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