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HN58C1001FP-15E

Description
128K X 8 EEPROM 5V, 150 ns, PDSO32
Categorystorage    storage   
File Size223KB,24 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Environmental Compliance
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HN58C1001FP-15E Overview

128K X 8 EEPROM 5V, 150 ns, PDSO32

HN58C1001FP-15E Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRenesas Electronics Corporation
Parts packaging codeSOIC
package instructionSOP, SOP32,.56
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time150 ns
command user interfaceNO
Data pollingYES
JESD-30 codeR-PDSO-G32
JESD-609 codee4
length20.45 mm
memory density1048576 bi
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
page size128 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)255
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height3 mm
Maximum standby current0.00002 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature16
switch bitYES
width11.3 mm
Maximum write cycle time (tWC)10 ms
HN58C1001 Series
1M EEPROM (128-kword
×
8-bit)
Ready/Busy and
RES
function
REJ03C0145-0800Z
(Previous ADE-203-028G (Z) Rev.7.0)
Rev. 8.00
Nov. 27. 2003
Description
Renesas Technology
's
HN58C1001 is an electrically erasable and programmable ROM organized as 131072-
word
×
8-bit. It has realized high speed, low power consumption and high reliability by employing advanced
MNOS memory technology and CMOS process and circuitry technology. It also has a 128-byte page
programming function to make the write operations faster.
Features
Single supply: 5.0 V
±
10%
Access time: 150 ns (max)
Power dissipation
Active: 20 mW/MHz, (typ)
Standby: 110
µW
(max)
On-chip latches: address, data,
CE, OE, WE
Automatic byte write: 10 ms (max)
Automatic page write (128 bytes): 10 ms (max)
Data
polling and RDY/Busy
Data protection circuit on power on/off
Conforms to JEDEC byte-wide standard
Reliable CMOS with MNOS cell technology
10 erase/write cycles (in page mode)
4
10 years data retention
Software data protection
Write protection by
RES
pin
There are also lead free products.
Rev.8.00, Nov. 27.2003, page 1 of 21

HN58C1001FP-15E Related Products

HN58C1001FP-15E HN58C1001FP-15 HN58C1001 HN58C1001T-15 HN58C1001T-15E
Description 128K X 8 EEPROM 5V, 150 ns, PDSO32 128K X 8 EEPROM 5V, 150 ns, PDSO32 128K X 8 EEPROM 5V, 150 ns, PDSO32 128K X 8 EEPROM 5V, 150 ns, PDSO32 128K X 8 EEPROM 5V, 150 ns, PDSO32
memory width 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 32 32 32 32 32
Maximum operating temperature 70 °C 70 °C 70 Cel 70 °C 70 °C
organize 128KX8 128KX8 128K × 8 128KX8 128KX8
surface mount YES YES Yes YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location DUAL DUAL pair DUAL DUAL
Is it lead-free? Lead free Contains lead - Contains lead Lead free
Is it Rohs certified? conform to incompatible - incompatible conform to
Maker Renesas Electronics Corporation Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code SOIC SOIC - TSOP TSOP
package instruction SOP, SOP32,.56 0.525 INCH, PLASTIC, SOP-32 - 8 X 14 MM, PLASTIC, TSOP-32 TSSOP, TSSOP32,.56,20
Contacts 32 32 - 32 32
Reach Compliance Code unknow unknow - unknow unknow
ECCN code EAR99 EAR99 - EAR99 EAR99
Maximum access time 150 ns 150 ns - 150 ns 150 ns
command user interface NO NO - NO NO
Data polling YES YES - YES YES
JESD-30 code R-PDSO-G32 R-PDSO-G32 - R-PDSO-G32 R-PDSO-G32
JESD-609 code e4 e0 - e0 -
length 20.45 mm 20.45 mm - 12.4 mm 12.4 mm
memory density 1048576 bi 1048576 bi - 1048576 bi 1048576 bi
Memory IC Type EEPROM EEPROM - EEPROM EEPROM
word count 131072 words 131072 words - 131072 words 131072 words
character code 128000 128000 - 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP - TSSOP TSSOP
Encapsulate equivalent code SOP32,.56 SOP32,.56 - TSSOP32,.56,20 TSSOP32,.56,20
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
page size 128 words 128 words - 128 words 128 words
Parallel/Serial PARALLEL PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 255 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V - 5 V 5 V
Programming voltage 5 V 5 V - 5 V 5 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
ready/busy YES YES - YES YES
Maximum seat height 3 mm 3 mm - 1.2 mm 1.2 mm
Maximum standby current 0.00002 A 0.00002 A - 0.00002 A 0.00002 A
Maximum slew rate 0.05 mA 0.05 mA - 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V - 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V - 5 V 5 V
technology CMOS CMOS - CMOS CMOS
Terminal surface NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) -
Terminal pitch 1.27 mm 1.27 mm - 0.5 mm 0.5 mm
Maximum time at peak reflow temperature 16 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
switch bit YES YES - YES YES
width 11.3 mm 11.3 mm - 8 mm 8 mm
Maximum write cycle time (tWC) 10 ms 10 ms - 10 ms 10 ms
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