LMC555MD8 datasheet, PDF - EEWORLD Datasheet

LMC555MD8: DescriptionPULSE; RECTANGULAR, 3MHz, TIMER, UUC, DIE; CategoryAnalog mixed-signal IC The signal circuit; File Size2MB，32 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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LMC555MD8 Overview

PULSE; RECTANGULAR, 3MHz, TIMER, UUC, DIE

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	DIE
package instruction	DIE,
Reach Compliance Code	compliant
ECCN code	EAR99
Analog Integrated Circuits - Other Types	PULSE; RECTANGULAR
JESD-30 code	X-XUUC-N
Humidity sensitivity level	1
Number of functions	1
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Maximum output frequency	3 GHz
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum supply voltage (Vsup)	12 V
Minimum supply voltage (Vsup)	1.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	40
Base Number Matches	1

	LMC555MD8	LMC555MWA	LMC555J/883	LMC555ENG
Description	PULSE; RECTANGULAR, 3MHz, TIMER, UUC, DIE	PULSE; RECTANGULAR, 3MHz, TIMER, UUC, WAFER	PULSE; RECTANGULAR, 3MHz, TIMER, CDIP8, CERAMIC, DIP-8	PULSE; RECTANGULAR, 3MHz, TIMER, PDIP8, PLASTIC, DIP-8
Parts packaging code	DIE	WAFER	DIP	DIP
package instruction	DIE,	DIE,	CERAMIC, DIP-8	DIP,
Reach Compliance Code	compliant	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Analog Integrated Circuits - Other Types	PULSE; RECTANGULAR	PULSE; RECTANGULAR	PULSE	PULSE; RECTANGULAR
JESD-30 code	X-XUUC-N	X-XUUC-N	R-GDIP-T8	R-PDIP-T8
Number of functions	1	1	1	1
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Maximum output frequency	3 GHz	3 GHz	3 GHz	3 GHz
Package body material	UNSPECIFIED	UNSPECIFIED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIE	DIE	DIP	DIP
Package shape	UNSPECIFIED	UNSPECIFIED	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	UNCASED CHIP	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal location	UPPER	UPPER	DUAL	DUAL
Maximum supply voltage (Vsup)	12 V	12 V	-	12 V
Minimum supply voltage (Vsup)	1.5 V	1.5 V	-	1.5 V
Maker	-	Texas Instruments	Texas Instruments	Texas Instruments

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