PULSE; RECTANGULAR, 3MHz, TIMER, UUC, WAFER
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | WAFER |
| package instruction | DIE, |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Analog Integrated Circuits - Other Types | PULSE; RECTANGULAR |
| JESD-30 code | X-XUUC-N |
| Number of functions | 1 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Maximum output frequency | 3 GHz |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 12 V |
| Minimum supply voltage (Vsup) | 1.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| LMC555MWA | LMC555MD8 | LMC555J/883 | LMC555ENG | |
|---|---|---|---|---|
| Description | PULSE; RECTANGULAR, 3MHz, TIMER, UUC, WAFER | PULSE; RECTANGULAR, 3MHz, TIMER, UUC, DIE | PULSE; RECTANGULAR, 3MHz, TIMER, CDIP8, CERAMIC, DIP-8 | PULSE; RECTANGULAR, 3MHz, TIMER, PDIP8, PLASTIC, DIP-8 |
| Parts packaging code | WAFER | DIE | DIP | DIP |
| package instruction | DIE, | DIE, | CERAMIC, DIP-8 | DIP, |
| Reach Compliance Code | unknown | compliant | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Analog Integrated Circuits - Other Types | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE | PULSE; RECTANGULAR |
| JESD-30 code | X-XUUC-N | X-XUUC-N | R-GDIP-T8 | R-PDIP-T8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Maximum output frequency | 3 GHz | 3 GHz | 3 GHz | 3 GHz |
| Package body material | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIE | DIE | DIP | DIP |
| Package shape | UNSPECIFIED | UNSPECIFIED | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | UNCASED CHIP | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | UPPER | UPPER | DUAL | DUAL |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments |
| Maximum supply voltage (Vsup) | 12 V | 12 V | - | 12 V |
| Minimum supply voltage (Vsup) | 1.5 V | 1.5 V | - | 1.5 V |