PULSE; RECTANGULAR, 3MHz, TIMER, CDIP8, CERAMIC, DIP-8
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | CERAMIC, DIP-8 |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Analog Integrated Circuits - Other Types | PULSE |
| JESD-30 code | R-GDIP-T8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Maximum output frequency | 3 GHz |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.08 mm |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| LMC555J/883 | LMC555MD8 | LMC555MWA | LMC555ENG | |
|---|---|---|---|---|
| Description | PULSE; RECTANGULAR, 3MHz, TIMER, CDIP8, CERAMIC, DIP-8 | PULSE; RECTANGULAR, 3MHz, TIMER, UUC, DIE | PULSE; RECTANGULAR, 3MHz, TIMER, UUC, WAFER | PULSE; RECTANGULAR, 3MHz, TIMER, PDIP8, PLASTIC, DIP-8 |
| Parts packaging code | DIP | DIE | WAFER | DIP |
| package instruction | CERAMIC, DIP-8 | DIE, | DIE, | DIP, |
| Reach Compliance Code | unknown | compliant | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Analog Integrated Circuits - Other Types | PULSE | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE; RECTANGULAR |
| JESD-30 code | R-GDIP-T8 | X-XUUC-N | X-XUUC-N | R-PDIP-T8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Maximum output frequency | 3 GHz | 3 GHz | 3 GHz | 3 GHz |
| Package body material | CERAMIC, GLASS-SEALED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIE | DIE | DIP |
| Package shape | RECTANGULAR | UNSPECIFIED | UNSPECIFIED | RECTANGULAR |
| Package form | IN-LINE | UNCASED CHIP | UNCASED CHIP | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal location | DUAL | UPPER | UPPER | DUAL |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments |
| Maximum supply voltage (Vsup) | - | 12 V | 12 V | 12 V |
| Minimum supply voltage (Vsup) | - | 1.5 V | 1.5 V | 1.5 V |