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FM25C040ULZEM8

Description
EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8
Categorystorage    storage   
File Size855KB,17 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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FM25C040ULZEM8 Overview

EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8

FM25C040ULZEM8 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeSOIC
package instructionSOP,
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum clock frequency (fCLK)1 MHz
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.9 mm
memory density4096 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512X8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.75 mm
Serial bus typeSPI
Maximum supply voltage (Vsup)4.5 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Maximum write cycle time (tWC)15 ms
Base Number Matches1
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FM25C040ULZEM8 Related Products

FM25C040ULZEM8 FM25C040ULVMT8 FM25C040ULMT8 FM25C040ULEN FM25C040ULZEMT8 FM25C040ULVM8
Description EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8 EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM, 512X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 EEPROM, 512X8, Serial, CMOS, PDSO8, PLASTIC, SO-8
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC SOIC SOIC DIP SOIC SOIC
package instruction SOP, TSSOP, TSSOP, DIP, TSSOP, SOP,
Contacts 8 8 8 8 8 8
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz 1 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e0 e0 e0 e0 e0 e0
length 4.9 mm 4.4 mm 4.4 mm 9.817 mm 4.4 mm 4.9 mm
memory density 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 512 words 512 words 512 words 512 words 512 words 512 words
character code 512 512 512 512 512 512
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 125 °C 70 °C 85 °C 85 °C 125 °C
Minimum operating temperature -40 °C -40 °C - -40 °C -40 °C -40 °C
organize 512X8 512X8 512X8 512X8 512X8 512X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP TSSOP TSSOP DIP TSSOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.2 mm 1.2 mm 5.08 mm 1.2 mm 1.75 mm
Serial bus type SPI SPI SPI SPI SPI SPI
Maximum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL AUTOMOTIVE COMMERCIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 1.27 mm 0.65 mm 0.65 mm 2.54 mm 0.65 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm 3 mm 3 mm 7.62 mm 3 mm 3.9 mm
Maximum write cycle time (tWC) 15 ms 15 ms 15 ms 15 ms 15 ms 15 ms
Base Number Matches 1 1 1 1 - -
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