|
MT28F200B3SG-10ETB |
MT28F200B3WG-10ETT |
MT28F200B3WG-10ETB |
MT28F200B3SG-10ETT |
| Description |
Flash, 256KX8, 100ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44 |
Flash, 256KX8, 100ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 |
Flash, 256KX8, 100ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 |
Flash, 256KX8, 100ns, PDSO44, 0.600 INCH, PLASTIC, SOP-44 |
| Maker |
Micron Technology |
Micron Technology |
Micron Technology |
Micron Technology |
| Parts packaging code |
SOIC |
TSOP1 |
TSOP1 |
SOIC |
| package instruction |
0.600 INCH, PLASTIC, SOP-44 |
12 X 20 MM, PLASTIC, TSOP1-48 |
12 X 20 MM, PLASTIC, TSOP1-48 |
0.600 INCH, PLASTIC, SOP-44 |
| Contacts |
44 |
48 |
48 |
44 |
| Reach Compliance Code |
unknown |
compliant |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Maximum access time |
100 ns |
100 ns |
100 ns |
100 ns |
| Other features |
ALSO CONFG AS 128KX16; BOTTOM BOOT BLOCK |
ALSO CONFG AS 128KX16; TOP BOOT BLOCK |
ALSO CONFG AS 128KX16; BOTTOM BOOT BLOCK |
ALSO CONFG AS 128KX16; TOP BOOT BLOCK |
| startup block |
BOTTOM |
TOP |
BOTTOM |
TOP |
| JESD-30 code |
R-PDSO-G44 |
R-PDSO-G48 |
R-PDSO-G48 |
R-PDSO-G44 |
| length |
28.195 mm |
18.4 mm |
18.4 mm |
28.195 mm |
| memory density |
2097152 bit |
2097152 bit |
2097152 bit |
2097152 bit |
| Memory IC Type |
FLASH |
FLASH |
FLASH |
FLASH |
| memory width |
8 |
8 |
8 |
8 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
44 |
48 |
48 |
44 |
| word count |
262144 words |
262144 words |
262144 words |
262144 words |
| character code |
256000 |
256000 |
256000 |
256000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| organize |
256KX8 |
256KX8 |
256KX8 |
256KX8 |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
SOP |
TSOP1 |
TSOP1 |
SOP |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Programming voltage |
3 V |
3 V |
3 V |
3 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
2.7 mm |
1.2 mm |
1.2 mm |
2.7 mm |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
| Minimum supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
1.27 mm |
0.5 mm |
0.5 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
| type |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
| width |
12.6 mm |
12 mm |
12 mm |
12.6 mm |
| Base Number Matches |
1 |
1 |
1 |
- |
| Is it lead-free? |
- |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
- |
incompatible |
incompatible |
incompatible |
| JESD-609 code |
- |
e0 |
e0 |
e0 |
| Peak Reflow Temperature (Celsius) |
- |
235 |
235 |
235 |
| Terminal surface |
- |
TIN LEAD |
TIN LEAD |
TIN LEAD |
| Maximum time at peak reflow temperature |
- |
30 |
30 |
30 |