HB56UW3272ETK-5F datasheet, PDF

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HB56UW3272ETK-5F: DescriptionEDO DRAM Module, 32MX72, 50ns, CMOS, SOCKET TYPE, DIMM-168; Categorystorage storage; File Size215KB，27 Pages; ManufacturerELPIDA; Websitehttp://www.elpida.com/en

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HB56UW3272ETK-5F Overview

EDO DRAM Module, 32MX72, 50ns, CMOS, SOCKET TYPE, DIMM-168

HB56UW3272ETK-5F Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIMM
package instruction	DIMM, DIMM168
Contacts	168
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE WITH EDO
Maximum access time	50 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	2415919104 bit
Memory IC Type	EDO DRAM MODULE
memory width	72
Humidity sensitivity level	1
Number of functions	1
Number of ports	1
Number of terminals	168
word count	33554432 words
character code	32000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	53.34 mm
Maximum standby current	0.028 A
Maximum slew rate	2.44 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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HB56UW3272ETK-F

Description

Features

256MB Buffered EDO DRAM DIMM

32-Mword

72-bit, 4k Refresh, 2 Bank Module

(36 pcs of 16M

4 components)

E0100H10 (1st edition)

(Previous ADE-203-1124A (Z))

Jan. 31, 2001

The HB 56UW 3272ETK belongs to 8-byte DI MM (D ual in-line Memory Module) fa mily , and has bee n

deve loped an optimiz ed main memory solution for 4 and 8-byte proc essor applica tions.

The

HB 56UW 3272ETK is 32 M

72 Dyna mic R AM Module, mounted 36 piec es of 64-Mbit DR AM

(H M5165405) sea led in TS OP pac kage and 2 piec es of 16-bit line drive r sea led in TS SOP pac kage . The

HB56UW3272ETK offers Extended Data Out (EDO) Page Mode as a high speed access mode. An outline of

the HB 56UW 3272ETK is 168-pin socke t type pac kage (dua l lea d out). The ref ore, the HB 56UW 3272ETK

makes high density mounting possible without surface mount technology. The HB56UW3272ETK provides

common data inputs and outputs. De coupling ca pac itor s ar e mounted beside ea ch TS OP on the module

board.

•

168-pin socket type package (Dual lead out)



Outline : 133.35 mm (Length)

53.34 mm (Height)

4.00 mm (Thickness)



Lead pitch : 1.27 mm

•

Single 3.3 V supply: 3.3

0.3V

•

High speed



Access time: t

RAC

= 50 ns/60 ns (max)



Access time: t

CAC

= 18 ns/20 ns (max)

•

Low power dissipation



Active mode: 8.78 W/7.49 W (max)



Standby mode (TTL): 295.2 mW (max)

•

JEDEC standard outline buffered 8-byte DIMM

•

Buffered input except

RAS

and DQ

•

4-byte interleave enabled, dual address input (A0/B0)

•

EDO page mode capability

Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.

This Product become EOL in August, 2005.

HB56UW3272ETK-5F Related Products

	HB56UW3272ETK-5F	HB56UW3272ETK-6F
Description	EDO DRAM Module, 32MX72, 50ns, CMOS, SOCKET TYPE, DIMM-168	EDO DRAM Module, 32MX72, 60ns, CMOS, SOCKET TYPE, DIMM-168
Is it Rohs certified?	incompatible	incompatible
Parts packaging code	DIMM	DIMM
package instruction	DIMM, DIMM168	DIMM, DIMM168
Contacts	168	168
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
access mode	FAST PAGE WITH EDO	FAST PAGE WITH EDO
Maximum access time	50 ns	60 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH
I/O type	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168
memory density	2415919104 bit	2415919104 bit
Memory IC Type	EDO DRAM MODULE	EDO DRAM MODULE
memory width	72	72
Humidity sensitivity level	1	1
Number of functions	1	1
Number of ports	1	1
Number of terminals	168	168
word count	33554432 words	33554432 words
character code	32000000	32000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	32MX72	32MX72
Output characteristics	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	225	225
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
refresh cycle	4096	4096
Maximum seat height	53.34 mm	53.34 mm
Maximum standby current	0.028 A	0.028 A
Maximum slew rate	2.44 mA	2.08 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1

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