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KM68FR1000ZI-300

Description
Standard SRAM, 128KX8, 300ns, CMOS, PBGA48, CSP-48
Categorystorage    storage   
File Size232KB,11 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

KM68FR1000ZI-300 Overview

Standard SRAM, 128KX8, 300ns, CMOS, PBGA48, CSP-48

KM68FR1000ZI-300 Parametric

Parameter NameAttribute value
Parts packaging codeBGA
package instructionVFBGA,
Contacts48
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time300 ns
JESD-30 codeR-PBGA-B48
length8 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals48
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height0.81 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
width6 mm
Base Number Matches1
KM68FV1000, KM68FS1000, KM68FR1000 Family
Document Title
128K x8 bit Super Low Power and Low Voltage Full CMOS Static RAM
CMOS SRAM
Revision History
Revision No. History
0.0
0.1
Initial draft
Revise
- Erase 100ns from KM68FS1000 Family
- Add 150ns for KM68FS1000 Family
- Add 32-sTSOP1 new package
- Add high power version
I
SB1
=5.0µA(Max)
- Change V
DR
(Min) 1.0 to 1.5V
Finalize
- Concept change high power version to low low power version
I
SB1
=5.0µA(Max)
- Change super low power version with special handling
I
SB1
=1.0µA(Max)
- Icc & Icc1(Read) decrease 10 to 5mA
Revise
- Change datasheet format
- Remove reverse type package from product
- Remove reserved speed bin(100ns)
Revise
- Add CSP type packaged product.
- Improved I
CC2
Draft Date
March 15, 1996
July 7, 1996
Remark
Advance
Preliminary
1.0
December 1, 1996
Final
2.0
February 26, 1998
Final
3.0
July 29, 1998
Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.
1
Revision 3.0
July 1998
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