CD4052BD datasheet, PDF - EEWORLD Datasheet

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CD4052BD: DescriptionDifferential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16,; CategoryAnalog mixed-signal IC The signal circuit; File Size341KB，7 Pages; ManufacturerRCA

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CD4052BD Overview

Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16,

CD4052BD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	DIFFERENTIAL MULTIPLEXER
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Number of channels	4
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Certification status	Not Qualified
surface mount	NO
switch	BREAK-BEFORE-MAKE
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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CD4052BD Related Products

	CD4052BD	CD4051BF	CD4052BF	CD4051BE	CD4051BD	CD4052BE	CD4053BF	CD4053BE	CD4053BD	CD4052BK
Description	Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16,	Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16,	Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16,	Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDIP16,	Single-Ended Multiplexer, 1 Func, 8 Channel, MOS, CDIP16, CERAMIC, DIP-16	Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP16,	Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16,	Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, PDIP16,	Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16,	Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDFP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknown
Analog Integrated Circuits - Other Types	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-GDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDFP-F16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Number of channels	4	8	4	8	8	4	2	2	2	4
Number of functions	1	1	1	1	1	1	3	3	3	1
Number of terminals	16	16	16	16	16	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C	125 °C	85 °C	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DFP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	YES
switch	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
technology	CMOS	CMOS	CMOS	CMOS	MOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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