Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDFP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| Number of channels | 4 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| surface mount | YES |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |

| CD4052BK | CD4051BF | CD4052BF | CD4051BE | CD4051BD | CD4052BD | CD4052BE | CD4053BF | CD4053BE | CD4053BD | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDFP16, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16, | Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDIP16, | Single-Ended Multiplexer, 1 Func, 8 Channel, MOS, CDIP16, CERAMIC, DIP-16 | Differential Multiplexer, 1 Func, 4 Channel, CMOS, CDIP16, | Differential Multiplexer, 1 Func, 4 Channel, CMOS, PDIP16, | Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16, | Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, PDIP16, | Single-Ended Multiplexer, 3 Func, 2 Channel, CMOS, CDIP16, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of channels | 4 | 8 | 4 | 8 | 8 | 4 | 4 | 2 | 2 | 2 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 3 | 3 | 3 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C | -40 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DFP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | MOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |