IC,LOGIC GATE,2/2/2/3IN AND-NOR,STD-TTL,DIP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | AND-OR-INVERT GATE |
| MaximumI(ol) | 0.016 A |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Maximum supply current (ICC) | 17.7 mA |
| Prop。Delay @ Nom-Sup | 15 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DM9008CJ | DM9002CN | DM9008CN | DM9006CJ | DM9006CN | DM9009CJ | DM9009CN | |
|---|---|---|---|---|---|---|---|
| Description | IC,LOGIC GATE,2/2/2/3IN AND-NOR,STD-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,STD-TTL,DIP,14PIN,PLASTIC | IC,LOGIC GATE,2/2/2/3IN AND-NOR,STD-TTL,DIP,14PIN,PLASTIC | IC,GATE EXPANDER,STD-TTL,DIP,14PIN,CERAMIC | IC,GATE EXPANDER,STD-TTL,DIP,14PIN,PLASTIC | IC,LOGIC GATE,DUAL 4-INPUT NAND,STD-TTL,DIP,14PIN,CERAMIC | IC,LOGIC GATE,DUAL 4-INPUT NAND,STD-TTL,DIP,14PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 code | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Logic integrated circuit type | AND-OR-INVERT GATE | NAND GATE | AND-OR-INVERT GATE | - | - | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.016 A | 0.016 A | 0.016 A | - | - | 0.016 A | 0.016 A |
| Maximum supply current (ICC) | 17.7 mA | 6.1 mA | 17.7 mA | - | - | 14.6 mA | 14.6 mA |
| Prop。Delay @ Nom-Sup | 15 ns | 15 ns | 15 ns | - | - | 17 ns | 17 ns |
| Schmitt trigger | NO | NO | NO | - | - | NO | NO |
| Maker | - | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
京公网安备 11010802033920号
EEWORLD
