ZMD-Standard
February 2000
Package SSOP20
(5,3 mm)
Dimensions in millimetres
Based on JEDEC JEP95: MO-150
1 Dimensions
MDS
757
Supersedes
Edition 11.99
X
A
2
A
View X
0,1
k x 45°
20
1
Z
e
D
b
p
0,15
M
Dimensions of Sub-Group B1
A
max
b
Pmin
b
Pmax
e
nom
H
Emin
H
Emax
L
Pmin
Z
max
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
0,3 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
1,99
0,25
0,38
0,65
7,65
7,90
0,63
0,74
H
E
E
Dimensions of Sub-Group C1
A
min
A
1min
A
1max
A
2min
A
2max
c
min
c
max
D
min
*
D
max
*
E
min
*
E
max
*
k
min
°
min
°
max
1,73
0,05
0,21
1,68
1,78
0,09
0,20
7,07
7,33
5,20
5,38
0,25
0°
10°
* without mold-flash
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Check: signed Marx
Date: 16.02.2000
Quality: signed Lorenz
Doc-No.
QS-000757-HD-02
A
1
Lp
c
°
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