TaNFilm
®
Chip Carrier
Resistor Network
CCN Series
•
Qualified to DESC 87016 and 87017 military specifications
•
Gold, Sn/Pb and RoHS compliant terminations available
•
Ideal for all reflow soldering techniques
•
Meet JEDEC standard for type 'C' package
•
Custom schematics readily available
•
Absolute TCR to ±15 ppm/°C
The IRC TaNFilm
®
Chip Carrier Network offers higher lead density, increased component count, lower installed
resistor cost, better reliability, and is ideal for use with all surface mount solder techniques. In addition, the TaNFilm
®
leadless CCN provides all the unique qualities of our other TaNFilm
®
package configurations. Testing has demon-
strated performance exceeding MIL-PRF-914 Characteristic H.
Precise state-of-the-art laser trimming provides close tolerances and tight ratios. The TaNFilm
®
process enables
IRC to manufacture custom circuit configurations and multiple resistance values without sacrificing the tightest toler-
ance and tracking characteristics of precision networks. The Tantalum Nitride resistor material is passivated for
environmental protection surpassing military requirements and guaranteeing exceptional ratio stability.
For applications requiring a high degree of reliability, stability, accuracy and low noise, plus the advantages of new
resistor configurations, specify the IRC Leadless Chip Carrier Configuration Resistor Network.
Electrical Data
Resistance Range
Absolute Resistance Tolerance
Ratio Tolerance to R1
Power Rating @ 70°C
Operating Temperature Range
Absolute TCR
TCR Tracking
Noise
Termination Options
(nickel leach barrier)
Substrate Material
Construction
Custom circuits and special testing available.
10
Ω
to 300K
Ω
To ±0.1%
to ±0.01%
0.1 watt/resistor, 1.0 watt/network
-55°C to +150°C
To ±15ppm/°C
To ±5 ppm/°C
Less than -25 dB
Gold
60/40 Sn/Pb
100% matte-tin
99.5% pure alumina substrate
Epoxy overcoat (78xx)
Ceramic lid (79xx)
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
CCN Series Issue April 2009 Sheet 1 of 4
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
TaNFilm
®
Chip Carrier
Resistor Network
Power Derating Data
100
% Of Rated Power
50
10
25
70
125
Ambient Temperature (°C)
Ordering Data
Prefix
Model
7800: 20-pin, 19 resistor schematic, epoxy overcoat construction, 60/40 Sn/Pb solder plate terminations
7800LF: 20-pin, 19 resistor schematic, epoxy overcoat construction, 100% matte-tin (Pb-free) terminations
7807: 20-pin, 10 resistor schematic, epoxy overcoat construction, 60/40 Sn/Pb solder plate terminations
7807LF: 20-pin, 10 resistor schematic, epoxy overcoat construction, 100% matte-tin (Pb-free) terminations
7808: 20-pin, 10 resistor schematic, epoxy overcoat construction, 60/40 Sn/Pb solder plate terminations
7808LF: 20-pin, 10 resistor schematic, epoxy overcoat construction, 100% matte-tin (Pb-free) terminations
7809: 20-pin, 10 resistor schematic, epoxy overcoat construction, 60/40 Sn/Pb solder plate terminations
7809LF: 20-pin, 10 resistor schematic, epoxy overcoat construction, 100% matte-tin (Pb-free) terminations
7900: 20-pin, 19 resistor schematic, ceramic lid construction, gold over nickel plate terminations
7900SD: 20-pin, 19 resistor schematic, ceramic lid construction, Sn/Pb hot solder dipped terminations
7900LF: 20-pin, 19 resistor schematic, ceramic lid construction, 100% matte-tin (Pb-free) terminations
7907: 20-pin, 10 resistor schematic, ceramic lid construction, gold over nickel plate terminations
7907SD: 20-pin, 10 resistor schematic, ceramic lid construction, Sn/Pb hot solder dipped terminations
7907LF: 20-pin, 10 resistor schematic, ceramic lid construction, 100% matte-tin (Pb-free) terminations
7908: 20-pin, 10 resistor schematic, ceramic lid construction, gold over nickel plate terminations
7908SD: 20-pin, 10 resistor schematic, ceramic lid construction, Sn/Pb hot solder dipped terminations
7908LF: 20-pin, 10 resistor schematic, ceramic lid construction, 100% matte-tin (Pb-free) terminations
7909: 20-pin, 10 resistor schematic, ceramic lid construction, gold over nickel plate terminations
7909SD: 20-pin, 10 resistor schematic, ceramic lid construction, Sn/Pb hot solder dipped terminations
7909LF: 20-pin, 10 resistor schematic, ceramic lid construction, 100% matte-tin (Pb-free) terminations
CCN
-
7900 - 01 - 1001 - B - B
TCR/Screening Code
Code
00
01
02
03
04
05
06
07
11
Classification
Commercial Grade
Commercial Grade
Commercial Grade
Commercial Grade
MIL-PRF-914M Screened
MIL-PRF-914K Screened
MIL-PRF-914H Screened
MIL-PRF-914H Screened
Commercial Grade
Absolute TCR
±300ppm/°C
±100ppm/°C
±50ppm/°C
±25ppm/°C
±300ppm/°C
±100ppm/°C
±50ppm/°C
±25ppm/°C
±15ppm/°C
Resistance Code
Standard 4-Digit MIL Resistance Code. Example: 1001 = 1000Ω, 50R0 - 50Ω
Absolute Tolerance Code
B = ±0.1%; D = ±0.5%; F = ±1%; G = ±2%; J = ±5%
Ratio Tolerance to R
1
T = ±0.01%; Q = ±0.02%; A = ±0.05%; B = ±0.1%; D = ±0.5%; F = ±1%; G = ±2%
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
CCN Series Issue April 2009 Sheet 4 of 4
京公网安备 11010802033920号
EEWORLD
