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S71NS128NA0BJWRN1

Description
Memory Circuit, 8MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Categorystorage    storage   
File Size511KB,12 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance  
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S71NS128NA0BJWRN1 Overview

Memory Circuit, 8MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

S71NS128NA0BJWRN1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeBGA
package instruction8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Contacts56
Reach Compliance Codeunknown
JESD-30 codeR-PBGA-B56
JESD-609 codee2
length9.2 mm
memory density134217728 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals56
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize8MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width8 mm
Base Number Matches1
S71NS-N MCP Products
MirrorBit
TM
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Multiplexed Flash Memory:
256 Mb (16 Mb x 16-bit), 128 Mb (8 Mb x 16-bit) and
64 Mb (4 Mb x 16-bit) with Burst-mode Multiplexed
pSRAM: 64 Mb (4 Mb x 16-bit), 32 Mb (2 Mb x 16-bit)
and 16 Mb (1 Mb x 16-bit)
Data Sheet
ADVANCE
INFORMATION
Notice to Readers:
The Advance Information status indicates that this
document contains information on one or more products under development
at Spansion Inc. The information is intended to help you evaluate this product.
Do not design in this product without contacting the factory. Spansion Inc.
reserves the right to change or discontinue work on this proposed product
without notice.
Publication Number
S71NS-N_00
Revision
A
Amendment
3
Issue Date
October 10, 2006

S71NS128NA0BJWRN1 Related Products

S71NS128NA0BJWRN1 BD033-010-B-T-0-0730-0630-L-E S71NS064NA0BJWRT1 S71NS064NA0BJWRN1 S71NS128NC0BJWRN1
Description Memory Circuit, 8MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 Board Connector, 10 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, Memory Circuit, 4MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 Memory Circuit, 4MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 Memory Circuit, 8MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Is it Rohs certified? conform to conform to conform to conform to conform to
Reach Compliance Code unknown compliant unknown compliant unknown
JESD-609 code e2 e3 e2 e1 e2
Maximum operating temperature 85 °C 105 °C 85 °C 85 °C 85 °C
Minimum operating temperature -25 °C -40 °C -25 °C -25 °C -25 °C
Terminal pitch 0.5 mm 1.27 mm 0.5 mm 0.5 mm 0.5 mm
Maker SPANSION - - SPANSION SPANSION
Parts packaging code BGA - BGA BGA BGA
package instruction 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 - 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 TFBGA, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Contacts 56 - 56 56 56
JESD-30 code R-PBGA-B56 - R-PBGA-B56 R-PBGA-B56 R-PBGA-B56
length 9.2 mm - 9.2 mm 9.2 mm 9.2 mm
memory density 134217728 bit - 67108864 bit 67108864 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 16 - 16 16 16
Humidity sensitivity level 3 - 3 - 3
Number of functions 1 - 1 1 1
Number of terminals 56 - 56 56 56
word count 8388608 words - 4194304 words 4194304 words 8388608 words
character code 8000000 - 4000000 4000000 8000000
Operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
organize 8MX16 - 4MX16 4MX16 8MX16
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA - TFBGA TFBGA TFBGA
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH - GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 - 260 260 260
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm - 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 1.95 V - 1.95 V 1.95 V 1.95 V
Minimum supply voltage (Vsup) 1.7 V - 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V - 1.8 V 1.8 V 1.8 V
surface mount YES - YES YES YES
technology CMOS - CMOS CMOS CMOS
Temperature level OTHER - OTHER OTHER OTHER
Terminal surface Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) - Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) TIN SILVER COPPER Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal form BALL - BALL BALL BALL
Terminal location BOTTOM - BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 40 - 40 40 40
width 8 mm - 8 mm 8 mm 8 mm

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