S71NS064NA0BJWRN1 datasheet, PDF

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S71NS064NA0BJWRN1: DescriptionMemory Circuit, 4MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56; Categorystorage storage; File Size511KB，12 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S71NS064NA0BJWRN1 Overview

Memory Circuit, 4MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56

S71NS064NA0BJWRN1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	56
Reach Compliance Code	compliant
JESD-30 code	R-PBGA-B56
JESD-609 code	e1
length	9.2 mm
memory density	67108864 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	56
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm

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S71NS-N MCP Products

MirrorBit

1.8 Volt-only Simultaneous Read/Write,

Burst-mode Multiplexed Flash Memory:

256 Mb (16 Mb x 16-bit), 128 Mb (8 Mb x 16-bit) and

64 Mb (4 Mb x 16-bit) with Burst-mode Multiplexed

pSRAM: 64 Mb (4 Mb x 16-bit), 32 Mb (2 Mb x 16-bit)

and 16 Mb (1 Mb x 16-bit)

Data Sheet

ADVANCE

INFORMATION

Notice to Readers:

The Advance Information status indicates that this

document contains information on one or more products under development

at Spansion Inc. The information is intended to help you evaluate this product.

Do not design in this product without contacting the factory. Spansion Inc.

reserves the right to change or discontinue work on this proposed product

without notice.

Publication Number

S71NS-N_00

Revision

Amendment

Issue Date

October 10, 2006

A d v a n c e

I n f o r m a t i o n

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise

readers of product information or intended specifications throughout the product life cycle, in-

cluding development, qualification, initial production, and full production. In all cases, however,

readers are encouraged to verify that they have the latest information before finalizing their de-

sign. The following descriptions of Spansion data sheet designations are presented here to high-

light their presence and definitions.

Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more

specific products, but has not committed any design to production. Information presented in a

document with this designation is likely to change, and in some cases, development on the prod-

uct may discontinue. Spansion Inc. therefore places the following conditions upon Advance Infor-

mation content:

“This document contains information on one or more products under development at Spansion Inc. The

information is intended to help you evaluate this product. Do not design in this product without con-

tacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed

product without notice.”

Preliminary

The Preliminary designation indicates that the product development has progressed such that a

commitment to production has taken place. This designation covers several aspects of the prod-

uct life cycle, including product qualification, initial production, and the subsequent phases in the

manufacturing process that occur before full production is achieved. Changes to the technical

specifications presented in a Preliminary document should be expected while keeping these as-

pects of production under consideration. Spansion places the following conditions upon Prelimi-

nary content:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. The Preliminary status of this document indicates that product qualification has been completed,

and that initial production has begun. Due to the phases of the manufacturing process that require

maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-

tions due to changes in technical specifications.”

Combination

Some data sheets will contain a combination of products with different designations (Advance In-

formation, Preliminary, or Full Production). This type of document will distinguish these products

and their designations wherever necessary, typically on the first page, the ordering information

page, and pages with DC Characteristics table and AC Erase and Program table (in the table

notes). The disclaimer on the first page refers the reader to the notice on this page.

Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal

changes are expected, the Preliminary designation is removed from the data sheet. Nominal

changes may include those affecting the number of ordering part numbers available, such as the

addition or deletion of a speed option, temperature range, package type, or V

range. Changes

may also include those needed to clarify a description or to correct a typographical error or incor-

rect specification. Spansion Inc. applies the following conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s) described

herein. Spansion Inc. deems the products to have been in sufficient production volume such that sub-

sequent versions of this document are not expected to change. However, typographical or specification

corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local AMD or Fujitsu

sales office.

S71NS-N_00_A3 October 10, 2006

S71NS064NA0BJWRN1 Related Products

	S71NS064NA0BJWRN1	BD033-010-B-T-0-0730-0630-L-E	S71NS064NA0BJWRT1	S71NS128NA0BJWRN1	S71NS128NC0BJWRN1
Description	Memory Circuit, 4MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	Board Connector, 10 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator,	Memory Circuit, 4MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	Memory Circuit, 8MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	Memory Circuit, 8MX16, CMOS, PBGA56, 8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	compliant	compliant	unknown	unknown	unknown
JESD-609 code	e1	e3	e2	e2	e2
Maximum operating temperature	85 °C	105 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-40 °C	-25 °C	-25 °C	-25 °C
Terminal pitch	0.5 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm
Maker	SPANSION	-	-	SPANSION	SPANSION
Parts packaging code	BGA	-	BGA	BGA	BGA
package instruction	TFBGA,	-	8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	8 X 9.20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Contacts	56	-	56	56	56
JESD-30 code	R-PBGA-B56	-	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56
length	9.2 mm	-	9.2 mm	9.2 mm	9.2 mm
memory density	67108864 bit	-	67108864 bit	134217728 bit	134217728 bit
Memory IC Type	MEMORY CIRCUIT	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	-	16	16	16
Number of functions	1	-	1	1	1
Number of terminals	56	-	56	56	56
word count	4194304 words	-	4194304 words	8388608 words	8388608 words
character code	4000000	-	4000000	8000000	8000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	4MX16	-	4MX16	8MX16	8MX16
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	-	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	-	260	260	260
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	1.95 V	-	1.95 V	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.7 V	-	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	-	1.8 V	1.8 V	1.8 V
surface mount	YES	-	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS
Temperature level	OTHER	-	OTHER	OTHER	OTHER
Terminal surface	TIN SILVER COPPER	-	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal form	BALL	-	BALL	BALL	BALL
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	-	40	40	40
width	8 mm	-	8 mm	8 mm	8 mm
Humidity sensitivity level	-	-	3	3	3

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