MPAS-085-ZEGG-11 datasheet, PDF

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MPAS-085-ZEGG-11: DescriptionIC Socket, PGA85, 85 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder, ROHS COMPLIANT; CategoryThe connector socket; File Size2MB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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MPAS-085-ZEGG-11 Overview

IC Socket, PGA85, 85 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder, ROHS COMPLIANT

MPAS-085-ZEGG-11 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMTEC
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	2 weeks
Other features	ULTRA LOW INSERTION FORCE
body width	1.1 inch
subject depth	0.372 inch
body length	1.1 inch
Contact structure	11X11
Contact to complete cooperation	GOLD (30) OVER NICKEL (50)
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact material	BERYLLIUM COPPER
Contact style	RND PIN-SKT
current rating	1 A
Device slot type	IC SOCKET
Type of equipment used	PGA85
Dielectric withstand voltage	1000VAC V
Shell material	BRASS
Insulation resistance	5000000000 Ω
JESD-609 code	e4
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	85
Maximum operating temperature	125 °C
Minimum operating temperature	-65 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.1 mm
Terminal pitch	2.54 mm
Termination type	SOLDER
Base Number Matches	1

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F-211-1 SUPPLEMENT

(2,54mm) .100"

MPAS SERIES

MPAS–068–ZSGT–11

MPAS–144–ZSGT–13

PIN GRID ARRAY SOCKETS

Mates with:

MPAT, MVAT, MHAT, MSAT

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MPAS

Insulator Material:

Black G.F. Polyester

Contact:

BeCu

Shell:

Brass except Style K

Phosphor Bronze

Operating Temp Range:

-55°C to +105°C with Tin

-55°C to +125°C with Gold

Plating:

Au over 50µ" (1,27µm) Ni or

Sn over 100µ" (2,58µm) Cu or

50µ" (1,27µm) Ni

Current Rating:

Contact Resistance:

10mΩ max

Lead Size Range:

.015" (0,38mm) to

.022" (0,56mm) DIA

Insertion Force:

(Single contact only)

Style ZU = 1.5 oz (0,42N) max,

all others = 2.5 oz (0,69N) avg,

5.5 oz (1,53N) max

Withdrawal Force:

(Single contact only)

Style ZU = 1.5 oz (0,42N) max,

all others = 2.0 oz (0,56N) avg,

0.35 oz (0,97N) min

Lead-Free Solderable:

Wave, only

RoHS Compliant:

BODY

STYLE

COUNT

LEAD

STYLE

PLATING

OPTION

PIN OUT

CODE

OPTION

MPAS

= Standard Polyester

No. of Positions X .100 (2,54) SQ

–“XXX”

= Total Number

of Filled

Positions

= 30µ" (0,76µm)

Gold Contact,

10µ" (0,25µm)

Gold Shell

–2

= (9,14).360

Wire-Wrap

(–ZW only)

(2,54)

.100

= 30µ" (0,76µm)

Gold Contact,

Tin Shell

–3

= (6,60).260

Wire-Wrap

(–ZW only)

ALSO AVAILABLE

RoHS compliant

options.

Call Samtec.

–L

= Locking

Socket

(–ZS only)

fre

w.sam

tec.com/lead-

= Tin Contact

and Shell

(Styles –ZS &

–ZW only)

= 10µ" (5,08µm)

Gold Contact,

Tin Shell

(Style –ZS only)

(7,62)

.300

(3,43)

.135

Requires GT

Plating Option

–ZW

= Wire Wrap

Shorter w/w

tail lengths

available.

See OPTION.

(4,90)

.193

(1,32)

.052

DIA

(0,76)

.030

–ZE

= Elevated

(0,76)

.030

(1,32)

.052

DIA

(13,77)

.542

(0,89)

.035

DIA

(0,51)

.020

DIA

Insertion Depth = .125" to .170"

Style ZE Component Part No. = EZ-2P3

(4,32)

.170

(12,95)

.510

(8,86)

.348

Insertion Depth = .125" to .157"

Style ZW Component Part No. = EZ-1W1(1)

Style ZW-2 Component Part No. = EZ-1W1(2)

Style ZW-3 Component Part No. = EZ-1W1(3)

(0,64)

.025

–ZS, –ZU, –ZA

= Printed Circuit

(0,76)

.030

LEAD

STYLE

DIA

(0,51)

.020

(0,51)

.020

TAIL

(3,18)

.125

(4,57)

.180

OAL

(7,62)

.300

(8,89)

.350

(1,32)

.052

DIA

Insertion Depth = .095" to .145",

Style ZS Component Part No. = EZ-1P1

Style ZA Component Part No. = EZ-6P1

Option L Component Part No. = SC-1L1 or EZ-1L1

–ZS, –ZU

–ZA

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

Locking lead (–L) available.

See OPTION.

WWW.SAMTEC.COM

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