TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.35 MM HEIGHT, LEAD FREE, MICRO SMD-4
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | VFBGA, |
| Contacts | 4 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | S-PBGA-B4 |
| JESD-609 code | e0 |
| length | 0.975 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 4 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Certification status | Not Qualified |
| Maximum seat height | 0.425 mm |
| Nominal supply voltage | 2.7 V |
| surface mount | YES |
| Telecom integrated circuit types | RF AND BASEBAND CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| width | 0.975 mm |
| Base Number Matches | 1 |