AGLE30002-FG484YI datasheet, PDF

Datasheet> All Categories > Programmable logic devices> Programmable logic> AGLE30002-FG484YI

AGLE30002-FG484YI: DescriptionFPGA; CategoryProgrammable logic devices Programmable logic; File Size8MB，164 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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AGLE30002-FG484YI Overview

FPGA

AGLE30002-FG484YI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	,
Reach Compliance Code	compliant
JESD-609 code	e0
Humidity sensitivity level	3
Peak Reflow Temperature (Celsius)	230
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Terminal surface	TIN LEAD
Maximum time at peak reflow temperature	30
Base Number Matches	1

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Revision 12

IGLOOe Low Power Flash FPGAs

with Flash*Freeze Technology

Features and Benefits

Low Power

•

1.2 V to 1.5 V Core Voltage Support for Low Power

Supports Single-Voltage System Operation

Low-Power Active FPGA Operation

Flash*Freeze

Technology

Enables

Ultra-Low

Power

Consumption while Maintaining FPGA Content

• Flash*Freeze Pin Allows Easy Entry to / Exit from Ultra-Low-

Power Flash*Freeze Mode

• 600 k to 3 Million System Gates

• 108 to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

• Bank-Selectable I/O Voltages—Up to 8 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and

LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS

• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL

2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3

Class I and II

• Wide Range Power Supply Voltage Support per JESD8-B,

Allowing I/Os to Operate from 2.7 V to 3.6 V

• Wide Range Power Supply Voltage Support per JESD8-12,

Allowing I/Os to Operate from 1.14 V to 1.575 V

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold-Sparing I/Os

• Programmable Output Slew Rate and Drive Strength

• Programmable Input Delay

• Schmitt Trigger Option on Single-Ended Inputs

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the IGLOO

e Family

• Six CCC Blocks, Each with an Integrated PLL

• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,

and External Feedback

• Wide Input Frequency Range (1.5 MHz up to 250 MHz)

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM

Blocks (×1, ×2, ×4, ×9, and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

• M1 IGLOOe Devices—Cortex™-M1 Soft Processor Available

with or without Debug

High Capacity

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Live-at-Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

• 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System

Performance

• ISP Using On-Chip 128-Bit Advanced Encryption Standard

(AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock

Designed to Secure FPGA Contents

• Segmented, Hierarchical Routing and Clock Structure

• High-Performance, Low-Skew Global Network

• Architecture Supports Ultra-High Utilization

• 700 Mbps DDR, LVDS-Capable I/Os

• 1.2

1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

Clock Conditioning Circuit (CCC) and PLL

In-System Programming (ISP) and Security

High-Performance Routing Hierarchy

Pro (Professional) I/O

Embedded Memory

ARM Processor Support in IGLOOe FPGAs

Table 1 • IGLOOe Product Family

IGLOOe Devices

ARM-Enabled IGLOOe Devices

System Gates

VersaTiles (D-flip-flops)

Quiescent Current (typical) in Flash*Freeze Mode (µW)

RAM kbits (1,024 bits)

4,608-Bit Blocks

FlashROM Kbits (1,024 bits)

Secure (AES) ISP

CCCs with Integrated PLLs

VersaNet Globals

I/O Banks

Maximum User I/Os

Package Pins

FBGA

600,000

13,824

108

Yes

270

FG256, FG484

AGLE600

AGLE3000

M1AGLE3000

3,000,000

75,264

137

504

112

Yes

620

FG484, FG896

Notes:

1. Refer to the

Cortex-M1 Handbook

for more information.

2. Six chip (main) and twelve quadrant global networks are available.

3. For devices supporting lower densities, refer to the

IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology

datasheet.

September 2012

IGLOOe Low Power Flash FPGAs

Table of Contents

IGLOOe Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

IGLOOe DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-82

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-88

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-91

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-93

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-107

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-108

Pin Descriptions and Packaging

Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User-Defined Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1

3-2

3-3

3-4

3-5

3-6

Package Pin Assignments

FG256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

FG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5

FG896 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8

R ev i si o n 1 2

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