EEWORLDEEWORLDEEWORLD

Part Number

Search

SKKT26/16E

Description
Silicon Controlled Rectifier, 50A I(T)RMS, 25000mA I(T), 1600V V(DRM), 1600V V(RRM), 2 Element, TO-240AA, CASE A 5, SEMIPACK 1, 7 PIN
CategoryAnalog mixed-signal IC    Trigger device   
File Size889KB,4 Pages
ManufacturerSEMIKRON
Websitehttp://www.semikron.com
Environmental Compliance  
Download Datasheet Parametric Compare View All

SKKT26/16E Overview

Silicon Controlled Rectifier, 50A I(T)RMS, 25000mA I(T), 1600V V(DRM), 1600V V(RRM), 2 Element, TO-240AA, CASE A 5, SEMIPACK 1, 7 PIN

SKKT26/16E Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeTO-240AA
package instructionFLANGE MOUNT, R-XUFM-X7
Contacts7
Manufacturer packaging codeCASE A 5
Reach Compliance Codecompliant
Other featuresHIGH RELIABILITY, UL RECOGNIZED
Shell connectionISOLATED
Nominal circuit commutation break time80 µs
ConfigurationSERIES CONNECTED, 2 ELEMENTS
Critical rise rate of minimum off-state voltage1000 V/us
Maximum DC gate trigger current150 mA
Maximum DC gate trigger voltage3 V
Quick connection description2G
Description of screw terminalsA-K-AK
Maximum holding current200 mA
JEDEC-95 codeTO-240AA
JESD-30 codeR-XUFM-X7
JESD-609 codee2
Maximum leakage current10 mA
On-state non-repetitive peak current470 A
Number of components2
Number of terminals7
Maximum on-state current25000 A
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum rms on-state current50 A
Maximum repetitive peak off-state leakage current10000 µA
Off-state repetitive peak voltage1600 V
Repeated peak reverse voltage1600 V
surface mountNO
Terminal surfaceTin/Silver (Sn/Ag)
Terminal formUNSPECIFIED
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
Trigger device typeSCR
Base Number Matches1
SKKT 26, SKKH 26
THYRISTOR BRIDGE,SCR,BRIDGE
SEMIPACK
®
1
Thyristor / Diode Modules
SKKT 26
SKKH 26
Symbol
Conditions
Values
Units
Features
Typical Applications
1)
SKKT
SKKH
1
13-10-2004 NOS
© by SEMIKRON

SKKT26/16E Related Products

SKKT26/16E SKKT26/08E SKKT26/18E SKKT26/12E SKKT26/14E SKKH26/16E SKKT26/06E
Description Silicon Controlled Rectifier, 50A I(T)RMS, 25000mA I(T), 1600V V(DRM), 1600V V(RRM), 2 Element, TO-240AA, CASE A 5, SEMIPACK 1, 7 PIN Silicon Controlled Rectifier, 50A I(T)RMS, 800V V(DRM), 800V V(RRM), 2 Element, CASE A 5, SEMIPACK 1, 7 PIN Silicon Controlled Rectifier, 50A I(T)RMS, 32000mA I(T), 1800V V(DRM), 1800V V(RRM), 2 Element, CASE A 5, SEMIPACK 1, 7 PIN Silicon Controlled Rectifier, 50A I(T)RMS, 25000mA I(T), 1200V V(DRM), 1200V V(RRM), 2 Element, TO-240AA, CASE A 5, SEMIPACK 1, 7 PIN Silicon Controlled Rectifier, 50A I(T)RMS, 25000mA I(T), 1400V V(DRM), 1400V V(RRM), 2 Element, TO-240AA, CASE A 5, SEMIPACK 1, 7 PIN Silicon Controlled Rectifier, 50A I(T)RMS, 25000mA I(T), 1600V V(DRM), 1600V V(RRM), 1 Element, CASE A 6, SEMIPACK 1, 4 PIN Silicon Controlled Rectifier, 50A I(T)RMS, 600V V(DRM), 600V V(RRM), 2 Element, CASE A 5, SEMIPACK 1, 7 PIN
Parts packaging code TO-240AA TO-240 TO-240 TO-240AA TO-240AA TO-240 TO-240
package instruction FLANGE MOUNT, R-XUFM-X7 FLANGE MOUNT, R-XUFM-X7 FLANGE MOUNT, R-XUFM-X7 FLANGE MOUNT, R-XUFM-X7 FLANGE MOUNT, R-XUFM-X7 FLANGE MOUNT, R-XUFM-X4 FLANGE MOUNT, R-XUFM-X7
Contacts 7 3 3 7 7 3 3
Manufacturer packaging code CASE A 5 CASE A 5 CASE A 5 CASE A 5 CASE A 5 CASE A 6 CASE A 5
Reach Compliance Code compliant compliant compliant compliant compliant unknow compli
Other features HIGH RELIABILITY, UL RECOGNIZED HIGH RELIABILITY, UL RECOGNIZED HIGH RELIABILITY, UL RECOGNIZED HIGH RELIABILITY, UL RECOGNIZED HIGH RELIABILITY, UL RECOGNIZED HIGH RELIABILITY, UL RECOGNIZED HIGH RELIABILITY, UL RECOGNIZED
Shell connection ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED
Configuration SERIES CONNECTED, 2 ELEMENTS SERIES CONNECTED, 2 ELEMENTS SERIES CONNECTED, 2 ELEMENTS SERIES CONNECTED, 2 ELEMENTS SERIES CONNECTED, 2 ELEMENTS SINGLE WITH BUILT-IN DIODE SERIES CONNECTED, 2 ELEMENTS
JESD-30 code R-XUFM-X7 R-XUFM-X7 R-XUFM-X7 R-XUFM-X7 R-XUFM-X7 R-XUFM-X4 R-XUFM-X7
Number of components 2 2 2 2 2 1 2
Number of terminals 7 7 7 7 7 4 7
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum rms on-state current 50 A 50 A 50 A 50 A 50 A 50 A 50 A
Off-state repetitive peak voltage 1600 V 800 V 1800 V 1200 V 1400 V 1600 V 600 V
Repeated peak reverse voltage 1600 V 800 V 1800 V 1200 V 1400 V 1600 V 600 V
surface mount NO NO NO NO NO NO NO
Terminal form UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Terminal location UPPER UPPER UPPER UPPER UPPER UPPER UPPER
Trigger device type SCR SCR SCR SCR SCR SCR SCR
Is it lead-free? Lead free - Lead free Lead free Lead free - -
Is it Rohs certified? conform to - conform to conform to conform to conform to -
Nominal circuit commutation break time 80 µs - - 80 µs 80 µs 80 µs -
Critical rise rate of minimum off-state voltage 1000 V/us - - 1000 V/us 1000 V/us 1000 V/us -
Maximum DC gate trigger current 150 mA - 150 mA 150 mA 150 mA 150 mA -
Maximum DC gate trigger voltage 3 V - 3 V 3 V 3 V 3 V -
Quick connection description 2G - 2G 2G 2G G -
Description of screw terminals A-K-AK - A-K-AK A-K-AK A-K-AK A-K-AK -
Maximum holding current 200 mA - 200 mA 200 mA 200 mA 200 mA -
JESD-609 code e2 - e2 e2 e2 - -
Maximum leakage current 10 mA - 10 mA 10 mA 10 mA 10 mA -
On-state non-repetitive peak current 470 A - 550 A 470 A 470 A 470 A -
Maximum on-state current 25000 A - 32000 A 25000 A 25000 A 25000 A -
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Maximum repetitive peak off-state leakage current 10000 µA - - 10000 µA 10000 µA 10000 µA -
Terminal surface Tin/Silver (Sn/Ag) - Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) Tin/Silver (Sn/Ag) - -
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Base Number Matches 1 1 1 1 1 - -
Maker - SEMIKRON SEMIKRON - - SEMIKRON SEMIKRON
Real-time solution to single chip microcomputer delay
1. If the MCU uses the delay function to delay, that is, the empty waiting method is used to delay, but the MCU has only one core and cannot split itself to handle other things. If this method is used...
Aguilera Microcontroller MCU
Work experience that can save you 10 years of hard work_Everyone may wish to take a look
First: Don't think that staying in the comfort zone of the mind is forgivable.     Everyone has a comfort zone, in which they are very self-centered, unwilling to be disturbed, unwilling to be pushed,...
hanker510 Talking about work
Who has made a wireless communication module (GW200KB)? Can you give me a reference program?
It is said that the wireless communication module (GW200KB) can transmit 1.5Km. I want to use it for wireless communication. I read the manual and found only the pin description. Can anyone provide a ...
thesecond RF/Wirelessly
Chopping Noise Gain to Measure Op Amp Offset Voltage in Real Time
One of the most important specifications of an op amp is its input offset voltage. For many op amps this voltage can be ignored, but the problem is that offset voltage changes with temperature, flicke...
黑衣人 Power technology
PCB substrate design principles
1. In the PCB substrate, the pads of the DIE must be aligned with the direction of the binding wire, and the lead-out wires must also be aligned with the pad direction. For each DIE, a cross pad must ...
ESD技术咨询 PCB Design
How to write a large file to the SD card using MSP430f149
I have an array of size 58000, which contains 58000 hexadecimal numbers. How can I write it to the SD card using the FAT16 system? Using the array, the microcontroller capacity is insufficient and ove...
DLHNR Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 376  723  208  1113  580  8  15  5  23  12 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号