TSC426CPA datasheet, PDF - EEWORLD Datasheet

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TSC426CPA: DescriptionMOSFET Driver, CMOS, PDIP8,; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size839KB，11 Pages; ManufacturerTelCom Semiconductor, Inc. (Microchip Technology); Websitehttp://www.telcom-semi.com/

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TSC426CPA Overview

MOSFET Driver, CMOS, PDIP8,

TSC426CPA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T8
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	4.5/18 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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TSC426CPA Related Products

	TSC426CPA	TSC427MJA	TSC428CPA	TSC428MJA	TSC426IJA	TSC428IJA	TSC427IJA	TSC427CPA	TSC426MJA
Description	MOSFET Driver, CMOS, PDIP8,	Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8,	MOSFET Driver, CMOS, PDIP8,	Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8,	MOSFET Driver, CMOS, CDIP8,	MOSFET Driver, CMOS, CDIP8,	MOSFET Driver, CMOS, CDIP8,	MOSFET Driver, CMOS, PDIP8,	Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3	DIP, DIP8,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T8	R-XDIP-T8	R-PDIP-T8	R-XDIP-T8	R-XDIP-T8	R-XDIP-T8	R-XDIP-T8	R-PDIP-T8	R-XDIP-T8
Number of terminals	8	8	8	8	8	8	8	8	8
Maximum operating temperature	70 °C	125 °C	70 °C	125 °C	85 °C	85 °C	85 °C	70 °C	125 °C
Minimum operating temperature	-	-55 °C	-	-55 °C	-25 °C	-25 °C	-25 °C	-	-55 °C
Package body material	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	4.5/18 V	4.5/18 V	4.5/18 V	4.5/18 V	4.5/18 V	4.5/18 V	4.5/18 V	4.5/18 V	4.5/18 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	OTHER	OTHER	OTHER	COMMERCIAL	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	-	-	-	-	TelCom Semiconductor, Inc. (Microchip Technology)	TelCom Semiconductor, Inc. (Microchip Technology)	TelCom Semiconductor, Inc. (Microchip Technology)	TelCom Semiconductor, Inc. (Microchip Technology)	TelCom Semiconductor, Inc. (Microchip Technology)

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