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TSC427IJA

Description
MOSFET Driver, CMOS, CDIP8,
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size839KB,11 Pages
ManufacturerTelCom Semiconductor, Inc. (Microchip Technology)
Websitehttp://www.telcom-semi.com/
Download Datasheet Parametric Compare View All

TSC427IJA Overview

MOSFET Driver, CMOS, CDIP8,

TSC427IJA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTelCom Semiconductor, Inc. (Microchip Technology)
package instructionDIP, DIP8,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T8
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply4.5/18 V
Certification statusNot Qualified
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

TSC427IJA Related Products

TSC427IJA TSC426CPA TSC427MJA TSC428CPA TSC428MJA TSC426IJA TSC428IJA TSC427CPA TSC426MJA
Description MOSFET Driver, CMOS, CDIP8, MOSFET Driver, CMOS, PDIP8, Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8, MOSFET Driver, CMOS, PDIP8, Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8, MOSFET Driver, CMOS, CDIP8, MOSFET Driver, CMOS, CDIP8, MOSFET Driver, CMOS, PDIP8, Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3 DIP, DIP8,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T8 R-PDIP-T8 R-XDIP-T8 R-PDIP-T8 R-XDIP-T8 R-XDIP-T8 R-XDIP-T8 R-PDIP-T8 R-XDIP-T8
Number of terminals 8 8 8 8 8 8 8 8 8
Maximum operating temperature 85 °C 70 °C 125 °C 70 °C 125 °C 85 °C 85 °C 70 °C 125 °C
Minimum operating temperature -25 °C - -55 °C - -55 °C -25 °C -25 °C - -55 °C
Package body material CERAMIC PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V 4.5/18 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level OTHER COMMERCIAL MILITARY COMMERCIAL MILITARY OTHER OTHER COMMERCIAL MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker TelCom Semiconductor, Inc. (Microchip Technology) - - - - TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology) TelCom Semiconductor, Inc. (Microchip Technology)
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