Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code | R-XDIP-T8 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 4.5/18 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| TSC427MJA | TSC426CPA | TSC428CPA | TSC428MJA | TSC426IJA | TSC428IJA | TSC427IJA | TSC427CPA | TSC426MJA | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8, | MOSFET Driver, CMOS, PDIP8, | MOSFET Driver, CMOS, PDIP8, | Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8, | MOSFET Driver, CMOS, CDIP8, | MOSFET Driver, CMOS, CDIP8, | MOSFET Driver, CMOS, CDIP8, | MOSFET Driver, CMOS, PDIP8, | Buffer/Inverter Based MOSFET Driver, CMOS, CDIP8, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-PDIP-T8 | R-XDIP-T8 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C | 85 °C | 85 °C | 85 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | - | - | -55 °C | -25 °C | -25 °C | -25 °C | - | -55 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | OTHER | OTHER | OTHER | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | - | - | - | - | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) |
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