LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA08B/8H
Page 1/4
Package Dimensions
H
H
H
H
H
H
H
H
5.3
5.0
1.8
4.4
6.8X7=47.6
56.2±0.5
5.9
2.0
7.9
7.2
□
0.5
TYP
2.3TYP
12.5MIN
1.0MIN
- +
LH5520
3.8
5.3
6.0
1.8
8.0
2.0
1.5MAX
12.5MIN
□
0.5
TYP
1.0MIN
2.3TYP
Note : 1.All dimension are in millimeter tolerance is
±
0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA08B/8H
Page 2/4
Absolute Maximum Ratings at Ta=25
℃
Ratings
Parameter
Symbol
H
Forward Current
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
Reverse Current @5V
Operating Temperature
Storage Temperature
Soldering Temperature
I
F
I
FP
PD
Ir
T
opr
Tstg
Tsol
15
60
40
10
-40 ~ +85
-40 ~ +100
Max 260
℃
for 5 sec Max
(2mm from body)
mA
mA
mW
UNIT
μ
A
℃
℃
Typical Electrical & Optical Characteristics (Ta=25
℃
)
PART NO
MATERIAL
Emitted
COLOR
Forward
Peak
Spectral
voltage
wave
halfwidth
length
△λ
nm
@ 20mA(V)
λ
Pnm
Luminous
intensity
@10mA(mcd)
Viewing
angle
2
θ
1/2
(deg)
Lens
Min. Max. Min.
Typ.
LA08B/8H
GaP
Red
Red Diffused
697
90
1.7
2.6
0.5
1.5
142
Note : 1.The forward voltage data did not including
±
0.1V testing tolerance.
2. The luminous intensity data did not including
±
15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA08B/8H
Page 3/4
Typical Electro-Optical Characteristics Curve
H CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100
Relative Intensity
Normalize @20mA
1.0
2.0
5.0
2.5
2.0
1.5
1.0
0.5
0.0
10
1.0
0.1
3.0
4.0
1.0
10
100
1000
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Forward Current(mA)
Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA
Normalize @25
℃
Relative Intensity@20mA
Normalize @25
℃
-40
-20
0
20
40
60
80
100
1.2
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
1.1
1.0
0.9
0.8
Ambient Temperature(
℃
)
Ambient Temperature(
℃
)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0
600
700
800
900
1000
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA08B/8H
Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
Reference
Standard
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
High Temperature
Storage Test
1.Ta=105
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
JIS C 7021: B-12
High Temperature
High Humidity Test
1.Ta=65
℃±
5
℃
2.RH=90 %~95 %
3.t=240hrs
±
2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
Thermal Shock Test
1.Ta=105
℃±
5
℃
&-40
℃±
5
℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260
℃±
5
℃
2.Dwell time= 10
±
1sec.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230
℃±
5
℃
2.Dwell time=5
±
1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Embedded System
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