BOARD/WIRE-TO-BOARD
CONNECTORS
QUICKIE™ CABLE-TO-BOARD
CONNECTORS FOR
PIN-IN-PASTE PROCESSES
OVERVIEW
Quickie
TM
is FCI’s brand for cable-to-board connectors in
2.54mm pitch. The Quickie
TM
product range includes IDC
Receptacles, IDC Board Connectors, Shrouded Low Profile
Headers and Shrouded Eject Latch Headers.
FCI is adding four new series of Quickie Headers to its product
range, dedicated to Pin-in-Paste soldering processes. This
brochure gives additional information for the correct use of
Quickie PiP connectors in the application process.
QUICKIE™ CABLE-TO-BOARD CONNECTORS
FOR PIN-IN-PASTE PROCESSES
PIN-IN-PASTE
Pin-in-Paste (PiP) technology allows the use of TMT products in SMT manufacturing
processes. The connectors are automatically or manually placed on the board, then
soldered in the same operation as the SMT components. Despite this, the mechanical
strenght of the TMT soldering is maintained – still an important requirement for
connectors nowadays in many industrial or automotive applications.
PART NUMBER
8 - DIGIT
PART NUMBER
PLATING
TOTAL
POSTIONS
OPTION
LF
Shrouded superslim header
10056844
10056845
Vertical
Right Angle
6, 8, 10, 14, 16
20, 26, 30, 34, 40
0.76 µm Gold on mating
area, tin on soldier side
1
Tube without pick-up cap
Tape with pick-up cap (availability
according to TA-893)
U
A
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
QUICKIE™ CABLE-TO-BOARD CONNECTORS
FOR PIN-IN-PASTE PROCESSES
APPLICATION DESIGN GUIDELINES
For application in a Pin-in-Paste process, FCI recommends
the application design guidelines below.
STENCIL DESIGN
The stencil design is crucial for a good solder joint.
It determines the quantity of paste and the position of the
paste print on the board. Each PCB hole has its own stencil
aperture with enough spacing in between in order to have
separate solder deposits.
This prevents solder robbing from one hole to another and
guarantees the correct quantity of solder paste for each hole.
The print position is slightly asymmetrical so as to optimise
the flow of molten solder paste.
BOARD LAYOUT
Please use a hole of 1.00 mm ± 0.05 mm for an
optimum paste deposit. For automatic pick-and-place,
lean towardsthe upper end of the tolerance.
Refer also to TA-894 for further information.
PASTE APPLICATION
The quantity of paste for each hole depends on the
soldering process parameters and the degree of hole
filling. For the squeegee, FCI recommends a 45° angle.
You can use a smaller angle for an even greater degree of
hole filling. The squeegee moves in parallel with with the
shorter sides of the stencil apertures.
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
QUICKIE™ CABLE-TO-BOARD CONNECTORS
FOR PIN-IN-PASTE PROCESSES
CONNECTOR DESIGN
In order to achieve optimum soldering results, FCI launches dedicated Pin-in-Paste connectors
in the basics+ product range. These connectors are fully adapted to Pin-in-Paste processing
in all aspects, including plastic material, housing design, pin length, and packaging.
PLASTIC MATERIALS
Quickie PiP headers are moulded in high temperature
thermoplastic and are able to withstand temperature
exposure up to 260 °C peak for 10 to 30 seconds in a
convection, infrared or vapour-phase reflow oven.
MECHANICAL PERFORMANCE
Standoffs raise the housing body slightly above the PCB
surface and thus allow the molten solder paste to flow
freely from its printed position into the board hole and around
the pin. The standoffs are correctly positioned for
a good solder paste deposit around the pin. Please respect
the stencil design guidelines below in order to avoid paste
deposit around the standoffs.
PIN LENGTH
The connector lead length beyond the bottom of the PCB is
shorter than for traditional TMT products. Thus, the risk of
pushing out the solder paste when inserting the pin into the
PCB hole is very much limited. The solder paste will not stick
on the pin tip or even fall off completely, but stays around the
pin for free flow during soldering. FCI uses a solder tail length
of 2 ± 0.2 mm for Quickie Headers for a standard PCB of 1.6
mm thickness.
SPECIFICATIONS
For combining SMT and TMT components not only in the
soldering process, but also in the assembly process, FCI
proposes a choice of pick-and-place packaging for PIP
connectors. The most common part numbers are available
in tape-on-reel packaging, all others in tube.
TECHNICAL INFORMATION
MATERIALS
• Housing: High temperature thermoplastic
• Colour: Black
• Flammability rating: UL94V-O
• Pin: Phosphor bronze
• Plating: Gold and tin over 1.27µm nickel
MECHANICAL PERFORMANCE
• Pin retention: 20 N min.
RoHS INFORMATION
• This product is RoHS compatible according to the
European Union Directive 2002/95/IEC
SPECIFICATIONS
•
•
File no. E66906
File no. LR46923
BWBQUICKCTB0613EA4
ELECTRICAL PERFORMANCE
• Current rating: 3A continuous
• Insulation resistance: 10,000ΩM min.
• Dielectric withstanding voltage: 1,500V
• Product drawing: By 8-digit base part number
• Product specification: BUS-12-055
• Tape-on-Reel specification: TA-893
• Application specification: TA-894
• Reflow profile: TA-842
• Compatible with IR reflow soldering process
ENVIRONMENTAL
• Operating temperature range: -65°C to +125°C
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
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