EEWORLDEEWORLDEEWORLD

Part Number

Search

MMA0204504321DLF13

Description
Fixed Resistor, Metal Glaze/thick Film, 0.5W, 4320ohm, 400V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size378KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

MMA0204504321DLF13 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 4320ohm, 400V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT

MMA0204504321DLF13 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
JESD-609 codee1
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeCYLINDRICAL PACKAGE
method of packingTR, 13 INCH
Rated power dissipation(P)0.5 W
Rated temperature80 °C
resistance4320 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage400 V
Base Number Matches1
al Glaze
Glaze™ General Purpose
General Purpose
Metal
face
Surface Mount Power Resistor
Mount Power Resistor
es
Metal Glaze
General Purpose
·
Up to 2 watts
Mount Power Resistor
Surface
MM Series
MM Series
watts
00 volts
·
·
·
Up to 1000 volts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
to 2.2 megohm
2
range
Up to watts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Up to 1000 volts
aximum operating temperature
60/40 Solder
temperature
dielectric
over nickel barrier
coating
60/40 Solder
over nickel barrier
High
High
temperature
dielectric
coating
ical Data
Electrical Data
Industry
Footprint
Maximum
Resistance
Maximum
Resistance
IRC
Working
Size
Industry
Power
IRC
Working
Range
Power
Range
Type
Voltage
Code Footprint
Type
Voltage
(ohms)²
Rating
Rating
(ohms)²
MMA0204
F
B
1206
MMA0204
Tolerance
(+%)³
(+%)³
1, 2, 5
1, 2, 5
Tolerance
1, 2, 5
5
0.5
5
TCR
Product
(ppm/°C)³
(ppm/°C)³
Category
100
50, 100
50, 100
100
50, 100
50, 100
100
50, 100
TCR
100
Product
Category
1206
1/2
1/2
400
400
0.1 to 0.99
0.1 to 0.99
Low Range
Standard
1.0
20 to 348K
to 1.0M
0.1 to 0.99
20 to 348K
1.0 to 1.0M
Low Range
Standard
1, 2,
0.25, 0.5
1, 2, 5
0.25,
1, 2, 5
0.25, 0.5
1, 2, 5
50, 100
Tolerance
Tight
100
Standard
Low
50, 100
Range
Tight Toleran
Tight Tolerance
2512
MMB0207
1
700
0.1 to 0.99
1.0 to 2.21M
20 to 348K
1, 2, 5
Low Range
Standard
2512
MMB0207
H
3610
MMC0310
1
2
700
1000
1.0 to 2.21M
0.1 to 0.99
20
1.0 to 2.21M
to 348K
0.1 to 0.99
1.0 to 2.21M
1,
1, 2, 5
2,
50, 100
Range
Low
100
50, 100
¹Not to exceed
P x R
0.25, 0.5
1, 2, 5
1, 2, 5
50, 100
Standard
Tight Toleran
Standard
²Consult factory for tighter TCR, tolerance, or resistance values.
3610
MMC0310
2
1000
Low Range
ceed
P x R
Environmental Data
Temperature Coefficient
Thermal Shock
²Consult
ri
factory for tighter
i
TCR, tolerance, or resistance values.
ethod
Characte stics
Max mum Change
Test M
As specified
±0.5% +0.01
±0.25% +0.01
±1% for R>100K
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
P x R for 5 seconds
onmental Data
Low Temperature Operation
Characte
Short
cs
Overload
risti
Time
Maxim
±0.5%
Change
um
+0.01
Test Method
ture Coefficient
As
High Temperature Exposure
specified
+0.01
±0.5%
Resistance to Bonding Exposure
+0.01
+0.01
±0.5%
±0.25%
Solderability
Moisture Resistance
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow
(-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.3
soldered to board at 260°C for 10 seconds)
Shock
perature Operation
Life Test
±0.25% +0.01
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
±0.5% +0.01
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
me Overload
mperature Exposure
Terminal Adhesion Strength
±0.5% +0.01
+0.01
±0.5%
±1% for R>100K
±1% +0.01
±0.5% +0.01
no mechanical damage
±0.5% +0.01
MIL-R-55342E Par 4.7.5
hours @ 70°C intermittent)
MIL-R-55342E Par 4.7.10 (2000
2.5 x
P x
push from underside of mounted chip for
1200 gram
R for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Chip mounted in center of 90mm long board, deflected 5mm
60 seconds
ce to Bonding Exposure
General Note
General Note
Resistance to Board Bending
no mechanical damage
MIL-R-55342E Par 4.7.7
(Reflow
10 seconds
board at 260°C for 10 seconds
so as to exert pull on chip contacts for
soldered to
±0.25% +0.01
ility
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Facsimile:
Website: www.irctt.com
rpus Christi Te
r
A subsidiary of
Resistance
±0.5% +0.01
MIL-R-55342E
www.bitechnologies.com
cycles, total 240 hours)
Par 4.7.8 (10
www.irctt.com www.welwyn-tt.com
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
TT electronics plc
IRC reserves the right to make changes in product specification without notice or liability.
TT electronics reserves the right
and is considered accurate at time of going to print.
All information is subject to IRC’s own data
to make changes in product specification without notice or liability.
Wire and Film Technologies Division
Telephone:
© TT electronics plc
±0.5% +0.01
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent
09.12
8.86 LED small desk lamp converted to lithium battery charging
I bought a 8.86 LED desk lamp from a forum and thought it was rechargeable. When I received it, I realized it was a USB direct plug. I took it apart and installed a lithium battery for charging.The on...
眼大5子 DIY/Open Source Hardware
Some understanding of C language memory
The big topic of memory key: You must have a logical diagram of memory in your mind. What is the procedure? Program = Code + Data The code is placed in the code segment in Flash, and the variable data...
fish001 Microcontroller MCU
Gain popularity! ! Show off the DIY ALTERA FPGA development board
:victory: Gain popularity! ! Show off my DIY ALTERA FPGA development board, hope to get your comments...
qiuhanqing FPGA/CPLD
Brief Introduction of Chip Packaging Technology
[Source: Electronic Technology Information Network]Since Intel designed and manufactured a 4-bit microprocessor chip in 1971, in more than 20 years, the CPU has developed from Intel4004, 80286, 80386,...
fighting PCB Design
Problems with high frequency resonant amplifiers
I'm studying high-frequency circuits recently. I saw that the input signals of resonant amplifiers and power amplifiers in books are almost always coupled to the base of the transistor through a trans...
音速兔 Analog electronics
【Environmental sensor based on KW41Z】Part 2 - I2C communication task + BLE tuning based on FreeRTOS
[i=s]This post was last edited by liyuyao001 on 2017-7-22 01:17[/i] [size=14px][font=Tahoma][size=16px]Thanks to the forum administrator nmg for always reminding and following up, and always asking me...
liyuyao001 NXP MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2247  2240  132  1443  2626  46  3  30  53  4 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号