REVISIONS
LTR
A
B
DESCRIPTION
Changes in accordance with NOR 5962-R015-92
Boilerplate update, part of 5 year review. ksr
DATE (YR-MO-DA)
91-10-22
06-07-21
APPROVED
Michael A. Frye
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
B
15
B
16
B
17
B
18
REV
B
19
B
20
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
B
11
B
12
B
13
B
14
SHEET
PREPARED BY
Kenneth Rice
CHECKED BY
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
Raymond Monnin
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-06-20
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS 16K X 4
SRAM, MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
AMSC N/A
REVISION LEVEL
B
67268
1 OF
20
5962-86859
5962-E529-06
DSCC FORM 2233
APR 97
.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-86859
01
L
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Generic number
Circuit function
Access time
85 ns
85 ns
70 ns
70 ns
55 ns
55 ns
45 ns
45 ns
35 ns
35 ns
70 ns
70 ns
55 ns
55 ns
45 ns
45 ns
35 ns
35 ns
55 ns
55 ns
45 ns
45 ns
35 ns
35 ns
See 6.4
16K X 4 Static Ram
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
K
L
T
U
W
X
Y
Z
Descriptive designator
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
See Figure 1
CQCC4-N28
GDIP1-T22 or CDIP2-T22
CQCC3-N28
See Figure 1
See Figure 1
Terminals
24
24
22
28
22
28
22
22
Package style
flat package
dual-in-line package
dual-in-line package
leadless chip carrier package
dual-in-line package
leadless chip carrier package
dual-in-line package
leadless chip carrier package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86859
SHEET
B
2
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
) .............................................................................-0.5 V dc to +7.0 V dc 1/
DC output current............................................................................................20 mA
Ambient storage temperature..........................................................................-65°C to +150°C
Temperature under bias..................................................................................-55°C to +125°C
Thermal resistance, junction-to-case (Θ
JC
):
Cases K, L, U, W, and X ...............................................................................See MIL-STD-1835
Cases Y and T ..............................................................................................28°C/W 2/
Cases Z.........................................................................................................22°C/W 2/
Power dissipation (P
D
) ....................................................................................1.0 W
1.4 Recommended operating conditions.
Supply voltage (V
CC
) .......................................................................................+4.5 V dc to +5.5 V dc 1/
Ground voltage (V
SS
) ......................................................................................0 V dc
Input high voltage (V
IH
)....................................................................................+2.2 V dc to V
CC
+ 0.5 V dc
Input low voltage (V
IL
) .....................................................................................-0.5 V dc to .8 V dc 3/
Operating case temperature range (T
C
) ..........................................................-55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
__________
1/ All voltage referenced to V
SS
.
2/ When a thermal resistance value is included in MIL-STD-1835, it shall supersede the value stated herein.
3/ V
IL
negative undershoots to a minimum of -2.0 V dc are allowed with a maximum 20 ns pulse width.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86859
SHEET
B
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.2 Truth tables. The truth tables shall be as specified on figure 3.
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only.
Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the
internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor
testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements as
provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86859
SHEET
B
4
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
b.
c.
Tests shall be as specified in table II herein.
Subgroups 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
Subgroup 4 (C
I
and C
O
measurement) shall be measured only for initial qualification and after any process or design
changes which may affect input or output capacitance. Capacitance shall be measured between the designated
terminal and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all input and output
terminals tested.
Subgroups 7, 8A, and 8B shall include verification of the truth table.
d.
4.3.2 Groups C and D inspections.
a.
b.
End-point electrical parameters shall be as specified in table II herein.
Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
(2) T
A
= +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86859
SHEET
B
5
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